LED-BASED LIGHT-GENERATING MODULES FOR SOCKET ENGAGEMENT, AND METHODS OF ASSEMBLING, INSTALLING AND REMOVING SAME

• US 20060262545A1
• Filed: 05/23/2006
• Published: 11/23/2006
• Est. Priority Date: 05/23/2005
• Status: Active Grant

• Current Assignee: Signify North America Corporation (Signify N.V.)
• Original Assignee: Color Kinetics Incorporated (Signify N.V.)
• Inventors: Bass, Michael A., McCormick, Kevin, Piepgras, Colin, Mollnow, Tomas, Morgan, Frederick M., Chemel, Brian, Blackwell, Michael
• Granted Patent: US 7,766,518 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 8/02 of recess-mounted type, e.g. downlighters specially adapted for vehicle exteriors F21S41/00-F21S45/00
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 17/14 Bayonet-type fastening
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 21/04 Recessed bases
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 23/04 the elements being switches safety devices F21V25/00
• CPC Class Codes: F21V 29/60 characterised by the use of a forced flow of gas, e.g. air
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 7/0008 providing for indirect lighting
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

Modular lighting fixtures that allow convenient installation and removal of LED-based light-generating modules and controller modules. In one example, a modular lighting fixture includes a housing configured to be recessed into or disposed behind an architectural surface such as ceiling, wall, or soffit, in new or existing construction scenarios. The fixture housing includes a socket configured to facilitate one or more of a mechanical, electrical and thermal coupling of the light-generating module to the fixture housing. The ability to easily engage and disengage the LED-based light-generating module with the socket, without removing the fixture housing itself, allows for straightforward replacement of the light-generating module upon failure, or exchange with another module having different light-generating characteristics. Modular lighting controllers for such fixtures also may be easily installed in or removed from the fixture housing via the same access route by which the light-generating module is installed and removed.

Claims

1. A light-generating apparatus, comprising:

an LED assembly, comprising;

an assembly substrate; and

a plurality of LED subassemblies coupled to the assembly substrate, each LED subassembly of the plurality of LED subassemblies forming at least one of a mechanical connection, an electrical connection, and a first thermal connection to the assembly substrate;

a plurality of optical components; and

a chassis coupled to the LED assembly and including a plurality of chambers in which the plurality of optical components respectively are held, the chassis configured such that each optical component of the plurality of optical components is disposed in an optical path of a corresponding one of the plurality of LED subassemblies.

2. The apparatus of claim 1, wherein the apparatus is formed so as to have a shape resembling a hockey puck.

3. The apparatus of claim 1, wherein the chassis is a thermally conductive chassis.

4. The apparatus of claim 3, wherein the chassis is a die-cast metal chassis.

5. The apparatus of claim 3, further comprising at least one thermally conductive electrically insulating layer disposed between the LED assembly and the chassis so as to electrically insulate the assembly substrate from the chassis.

6. The apparatus of claim 5, wherein each LED subassembly of the plurality of LED subassemblies forms the first thermal connection to the assembly substrate, and wherein the assembly substrate forms a second thermal connection to the thermally conductive chassis, so as to facilitate heat dissipation from the plurality of LED subassemblies via the thermally conductive chassis.

7. The apparatus of claim 1, wherein the assembly substrate includes a printed circuit board.

8. The apparatus of claim 7, wherein the printed circuit board is formed of FR-4 material.

9. The apparatus of claim 7, wherein the printed circuit board is a formed of a flexible material.

10. The apparatus of claim 7, wherein the printed circuit board includes a top surface facing the chassis and a bottom surface to which are coupled the plurality of LED subassemblies.

11. The apparatus of claim 10, wherein each LED subassembly comprises:

an aluminum core substrate having a top surface facing the bottom surface of the printed circuit board; and

a plurality of first electrical contact points disposed only on the top surface of the aluminum core substrate.

12. The apparatus of claim 11, wherein the bottom surface of the printed circuit board includes a plurality of second electrical contact points that are soldered to the plurality of first electrical contact points to form the mechanical connection and the electrical connection between the assembly substrate and the plurality of LED subassemblies.

13. The apparatus of claim 12, wherein the top surface of the printed circuit board includes a plurality of third electrical contact points that are coupled to the plurality of second electrical contact points via a plurality of plated through-holes passing through the printed circuit board, and wherein the plurality of third electrical contact points, the plurality of plated through-holes, the plurality of second contact points, and the plurality of first electrical contact points form the first thermal connection between the assembly substrate and the plurality of LED subassemblies.

14. The apparatus of claim 10, wherein the printed circuit board includes a plurality of through-holes through which pass light generated by respective LED subassemblies of the plurality of LED subassemblies.

15. The apparatus of claim 1, wherein each LED subassembly has a hexagonal shape.

16. The apparatus of claim 1, wherein each LED subassembly includes at least one LED configured to generate essentially white light.

17. The apparatus of claim 16, wherein:

at least one first LED subassembly of the plurality of LED subassemblies includes at least one first LED configured to generate first essentially white light having a first color temperature; and

at least one second LED subassembly of the plurality of LED subassemblies includes at least one second LED configured to generate second essentially white light having a second color temperature different from the first color temperature.

18. The apparatus of claim 16, wherein each LED subassembly includes a plurality of LEDs configured to generate essentially white light.

19. The apparatus of claim 18, wherein the plurality of LEDs of each subassembly are electrically interconnected so as to be operated simultaneously.

20. The apparatus of claim 1, wherein each LED subassembly comprises an aluminum core substrate having a top surface and a bottom surface, wherein all electrical contacts or electrical components of the LED subassembly are disposed only on the top surface of the aluminum core substrate.

21. The apparatus of claim 1, wherein each LED subassembly comprises a lens to shape light generated by each LED subassembly.

22. The apparatus of claim 21, wherein the chassis and the LED assembly are configured such that each optical component of the plurality of optical components is appropriately aligned with the lens of the corresponding one of the plurality of LED subassemblies.

23. The apparatus of claim 1, wherein each LED subassembly includes at least one feature that facilitates registration with a corresponding one of the plurality of optical components.

24. The apparatus of claim 23, wherein each LED subassembly includes a plurality of cut-outs disposed along a perimeter.

25. The apparatus of claim 24, wherein each optical component of the plurality of optical components includes a plurality of posts that engage with the plurality of cut-outs of the corresponding one of the plurality of LED subassemblies.

26. The apparatus of claim 25, wherein the assembly substrate includes a plurality of holes aligned with the plurality of cut-outs disposed along the perimeter of each subassembly, and wherein the plurality of posts of each optical component passes through the plurality of holes in the assembly substrate to engage with the plurality of cut-outs of the corresponding one of the plurality of LED subassemblies.

27. The apparatus of claim 1, wherein each optical component of the plurality of optical components includes a plurality of clips to facilitate an interlocking mechanical engagement with a corresponding one of the plurality of chambers of the chassis.

28. The apparatus of claim 1, further comprising a thermally conductive base plate, wherein the LED assembly is disposed between the thermally conductive base plate and the chassis.

29. The apparatus of claim 28, wherein the thermally conductive base plate forms a third thermal connection with at least the plurality of LED subassemblies.

30. The apparatus of claim 29, wherein each LED subassembly comprises a thermally conductive substrate having a top surface and a bottom surface, wherein:

at least a portion of the top surface of each LED subassembly forms the at least one of the mechanical connection, the electrical connection, and the first thermal connection to the assembly substrate; and

the bottom surface of each LED subassembly forms at least a portion of the third thermal connection with the thermally conductive base plate.

31. The apparatus of claim 30, wherein the thermally conductive substrate of each LED subassembly includes an aluminum core substrate.

32. The apparatus of claim 29, wherein:

the thermally conductive base plate includes a first plurality of holes formed therein;

the chassis includes a plurality of threaded bores formed therein; and

the thermally conductive base plate is mechanically coupled to the chassis via a plurality of screws that pass through the first plurality of holes and engage with the plurality of threaded bores formed in the chassis.

33. The apparatus of claim 32, wherein the assembly substrate of the LED assembly includes a second plurality of holes through which pass the plurality of screws.

34. The apparatus of claim 33, wherein the assembly substrate has an essentially round shape, and wherein each hole of the second plurality of holes is disposed between two LED subassemblies coupled to the assembly substrate.

35. The apparatus of claim 29, wherein:

the assembly substrate has a top surface facing the chassis and a bottom surface facing the thermally conductive base plate;

the LED assembly further includes at least one electrical connector mounted to the bottom surface of the assembly substrate and electrically connected to the plurality of LED subassemblies; and

the thermally conductive base plate includes a connector through-hole, through which passes the at least one electrical connector.

36. The apparatus of claim 1, wherein the LED assembly further comprises at least one memory in which is stored information relating to the apparatus.

37. The apparatus of claim 36, wherein the information includes a unique identifier for the apparatus.

38. The apparatus of claim 37, wherein the unique identifier includes a serial number for the apparatus.

39. The apparatus of claim 36, wherein the information relates to at least one characteristic of light generated by the apparatus.

40. The apparatus of claim 36, wherein the information relates to at least one operating power requirement associated with the apparatus.

41. The apparatus of claim 36, wherein the information includes at least one calibration parameter associated with at least one LED subassembly of the plurality of LED subassemblies.

42. The apparatus of claim 36, wherein the information relates to an operating history associated with the apparatus.

43. The apparatus of claim 42, wherein the information relates to an operating temperature history associated with the apparatus.

44. The apparatus of claim 42, wherein the information relates to an operating time history associated with the apparatus.

45. A light-generating apparatus, comprising:

a thermally conductive chassis through which light exits from the apparatus;

an LED assembly to generate the light; and

a thermally conductive base plate, wherein;

the LED assembly is disposed between the thermally conductive base plate and the thermally conductive chassis;

the LED assembly and the thermally conductive chassis form a first thermal connection to facilitate first heat dissipation from the LED assembly via the thermally conductive chassis; and

the LED assembly and the thermally conductive base plate form a second thermal connection to facilitate second heat dissipation from the LED assembly via the thermally conductive base plate.

46. The apparatus of claim 45, wherein the apparatus is formed so as to have a shape resembling a hockey puck.

47. The apparatus of claim 45, wherein the apparatus is configured for insertion into a socket of a lighting fixture that facilitates a third thermal connection between the thermally conductive base plate and a thermally conductive housing of the lighting fixture, so as to further facilitate the second heat dissipation.

48. The apparatus of claim 45, wherein the chassis is a die-cast metal chassis.

49. The apparatus of claim 45, further comprising at least one thermally conductive electrically insulating layer disposed between the LED assembly and the chassis so as to electrically insulate the LED assembly from the chassis.

50. The apparatus of claim 45, wherein the LED assembly comprises:

an assembly substrate; and

a plurality of LED subassemblies coupled to the assembly substrate, each LED subassembly of the plurality of LED subassemblies forming at least a third thermal connection to the assembly substrate.

51. The apparatus of claim 50, wherein:

each LED subassembly comprises a thermally conductive substrate having a top surface and a bottom surface;

at least a portion of the top surface of each LED subassembly forms the third thermal connection to the assembly substrate;

at least a portion of a top surface of the assembly substrate forms the first thermal connection between the LED assembly and the thermally conductive chassis; and

the bottom surface of each LED subassembly forms at least a portion of the second thermal connection between the LED assembly and the thermally conductive base plate.

52. The apparatus of claim 51, wherein the apparatus is configured for insertion into a socket of a lighting fixture that facilitates a fourth thermal connection between the thermally conductive base plate and a thermally conductive housing of the lighting fixture, so as to further facilitate the second heat dissipation.

53. The apparatus of claim 50, wherein the assembly substrate includes a top surface facing the thermally conductive chassis and a bottom surface to which are coupled the plurality of LED subassemblies.

54. The apparatus of claim 53, wherein each LED subassembly comprises:

an aluminum core substrate having a top surface facing the bottom surface of the assembly substrate; and

a plurality of first electrical contact points disposed only on the top surface of the aluminum core substrate.

55. The apparatus of claim 54, wherein the bottom surface of the assembly substrate includes a plurality of second electrical contact points that are soldered to the plurality of first electrical contact points to form a mechanical connection and an electrical connection between the assembly substrate and the plurality of LED subassemblies.

56. The apparatus of claim 55, wherein the top surface of the assembly substrate includes a plurality of third electrical contact points that are coupled to the plurality of second electrical contact points via a plurality of plated through-holes passing through the assembly substrate, and wherein the plurality of third electrical contact points, the plurality of plated through-holes, the plurality of second contact points, and the plurality of first electrical contact points form the third thermal connection between the assembly substrate and the plurality of LED subassemblies.

57. A light-generating apparatus, comprising:

a circular chassis; and

a circular printed circuit board substrate coupled to the circular chassis, the circular printed circuit board substrate including at least one chip-on-board LED module.

58. The apparatus of claim 57, wherein the circular chassis is a thermally conductive chassis.

59. The apparatus of claim 57, further comprising at least one optical component disposed with respect to the at least one chip-on-board LED module to affect light generated by the at least one chip-on-board LED module.

60. The apparatus of claim 59, wherein the circular chassis includes at least one chamber for holding the at least one optical component such that the at least one optical component is disposed in an optical path of the at least one chip-on-board LED module.

61. The apparatus of claim 57, wherein the apparatus is formed so as to have a shape resembling a hockey puck.

62. The apparatus of claim 57, wherein the at least one chip-on-board LED module includes a plurality of chip-on-board LED modules disposed on the circular printed circuit board substrate.

63. The apparatus of claim 62, wherein the circular chassis includes a plurality of chambers through which light generated by the plurality of chip-on-board LED modules passes.

64. The apparatus of claim 63, further comprising a plurality of optical components respectively held in the plurality of chambers, such that each optical component of the plurality of optical components is disposed in an optical path of a corresponding one of the plurality of chip-on-board LED modules.

65. The apparatus of claim 62, wherein each chip-on-board LED module of the plurality of chip-on-board LED modules has a hexagonal shape.

66. The apparatus of claim 62, wherein each chip-on-board LED module of the plurality of chip-on-board LED modules has a shape suitable for tessellation.

67. The apparatus of claim 65, wherein the plurality of chip-on-board LED modules are disposed in at least a partial honeycomb pattern on the circular printed circuit board substrate.

68. The apparatus of claim 57, wherein the at least one chip-on-board LED module has a low thermal resistance.

69. The apparatus of claim 57, wherein the at least one chip-on-board LED module includes at least one LED and at least one other electronic component.

70. The apparatus of claim 57, wherein the at least one chip-on-board LED module includes at least one LED configured to generate essentially white light.

71. The apparatus of claim 57, wherein the circular printed circuit board substrate further comprises at least one memory in which is stored information relating to the apparatus.

72. The apparatus of claim 71, wherein the information includes a unique identifier for the apparatus.

73. The apparatus of claim 72, wherein the unique identifier includes a serial number for the apparatus.

74. The apparatus of claim 71, wherein the information relates to at least one characteristic of light generated by the apparatus.

75. The apparatus of claim 71, wherein the information relates to at least one operating power requirement associated with the apparatus.

76. The apparatus of claim 71, wherein the information includes at least one calibration parameter associated with at least one LED subassembly of the plurality of LED subassemblies.

77. The apparatus of claim 71, wherein the information relates to an operating history associated with the apparatus.

78. The apparatus of claim 77, wherein the information relates to an operating temperature history associated with the apparatus.

79. The apparatus of claim 77, wherein the information relates to an operating time history associated with the apparatus.