Method of manufacturing a semiconductor device

• US 20060263952A1
• Filed: 07/31/2006
• Published: 11/23/2006
• Est. Priority Date: 03/19/2001
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Hiroki, Masaaki, Yamazaki, Shunpei
• Granted Patent: US 7,674,635 B2
• Time in Patent Office: Days
• US Class Current: 438/149
• CPC Class Codes: G01R 31/2601 Apparatus or methods therefor G01R31/2607, G01R31/2642 take precedence
• CPC Class Codes: G01R 31/2607 Circuits therefor G01R31/2642 takes precedence
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G09G 3/006 Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors

Abstract

The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming. An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.

Claims

1-66. -66. (canceled)

67. A method of manufacturing a semiconductor device comprising:

providing a semiconductor device comprising a plurality of thin film transistors over a substrate;

providing a secondary coil over said substrate;

providing a waveform shaping circuit over said substrate;

inducing an AC voltage in said secondary coil by electromagnetic induction;

forming a driving signal by said waveform shaping circuit from said AC voltage;

supplying said driving signal to said semiconductor device to drive said semiconductor device;

detecting an electric field created by said semiconductor device as a result of supplying said driving signal thereto in order to decide whether said semiconductor device correctly operates or not.

68. A method of manufacturing a semiconductor device comprising:

providing a semiconductor device comprising a plurality of thin film transistors over a substrate;

providing a secondary coil over said substrate;

providing a rectifier circuit over said substrate;

inducing an AC voltage in said secondary coil by electromagnetic induction;

forming a driving signal by said rectifier circuit from said AC voltage;

supplying said driving signal to said semiconductor device to drive said semiconductor device;

detecting an electric field created by said semiconductor device as a result of supplying said driving signal thereto in order to decide whether said semiconductor device correctly operates or not.

69. A method of manufacturing a semiconductor device comprising:

providing a semiconductor device comprising a plurality of semiconductor elements arranged in a matrix over a substrate;

providing a secondary coil over said substrate;

providing a waveform shaping circuit over said substrate;

inducing an AC voltage in said secondary coil by electromagnetic induction;

forming a driving signal by said waveform shaping circuit from said AC voltage;

supplying said driving signal to said semiconductor device to drive said semiconductor device;

detecting a defect in said plurality of semiconductor elements by observing an electric field generated at each of said plurality of semiconductor elements.

70. A method of manufacturing a semiconductor device comprising:

providing a semiconductor device comprising a plurality of semiconductor elements arranged in a matrix over a substrate;

providing a secondary coil over said substrate;

providing a rectifier circuit over said substrate;

inducing an AC voltage in said secondary coil by electromagnetic induction;

forming a driving signal by said rectifier circuit from said AC voltage;

supplying said driving signal to said semiconductor device to drive said semiconductor device;

detecting a defect in said plurality of semiconductor elements by observing an electric field generated at each of said plurality of semiconductor elements.