System and method for analyzing electrical failure data
First Claim
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1. A system comprising:
- an input device for inputting requested information;
a controller for retrieving data associated with a group of wafers based on the requested information, each wafer in the group of wafers including a plurality of circuit dice, each of the circuit dice being located at a coordinate;
a calculating unit for performing a calculation on the data associated with the group of wafers; and
a display unit for displaying a wafer map showing results from the calculation, the wafer map including a plurality of map sections, wherein each of the map sections includes a first indicator representing a calculation result for electrical failure for the circuit dice at the same coordinate among the wafers.
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Abstract
Some embodiments of the invention include system and method for performing a calculation on the data associated with a group of wafers. The system and method display a wafer map having map indicators representing calculation results from the calculation. Other embodiments are described and claimed.
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Citations
40 Claims
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1. A system comprising:
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an input device for inputting requested information;
a controller for retrieving data associated with a group of wafers based on the requested information, each wafer in the group of wafers including a plurality of circuit dice, each of the circuit dice being located at a coordinate;
a calculating unit for performing a calculation on the data associated with the group of wafers; and
a display unit for displaying a wafer map showing results from the calculation, the wafer map including a plurality of map sections, wherein each of the map sections includes a first indicator representing a calculation result for electrical failure for the circuit dice at the same coordinate among the wafers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A system comprising:
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a tester for testing a plurality of wafers to obtain test results;
a storage unit for storing the test results; and
an analyzer for analyzing the test results, the analyzer including;
a calculating unit for performing a calculation on the test results; and
a display unit for displaying a wafer map showing results from the calculation, the wafer map including a plurality of map sections, wherein each of the map sections includes an indicator representing a calculation result for electrical failure for the circuit dice at the same coordinate among the wafers. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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24. A machine-readable medium having instructions stored thereon for causing a machine to perform a method, the method comprising:
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inputting requested information;
retrieving data associated with a group of wafers based on the requested information, each wafer in the group of wafers including a plurality of circuit dice, each of the circuit dice being located at a coordinate;
performing a calculation on the data associated with the group of wafers; and
displaying a wafer map showing results from the calculation, the wafer map including a plurality of map sections, wherein each of the map sections includes an indicator representing a calculation result for electrical failure for the circuit dice at the same coordinate among the wafers. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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31. A method comprising:
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inputting requested information;
retrieving data associated with a group of wafers based on the requested information, each wafer in the group of wafers including a plurality of circuit dice, each of the circuit dice being located at a coordinate;
performing a calculation on the data associated with the group of wafers; and
displaying a wafer map showing results from the calculation, the wafer map including a plurality of map sections, wherein each of the map sections includes a first indicator representing a calculation result for electrical failure for the circuit dice at the same coordinate among the wafers. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification