Surface mount package

• US 20060266546A1
• Filed: 05/24/2005
• Published: 11/30/2006
• Est. Priority Date: 05/24/2005
• Status: Active Grant

• Current Assignee: MACOM Technology Solutions Holdings, Inc.
• Original Assignee: M/A Com
• Inventors: Palmteer, William
• Granted Patent: US 7,595,453 B2
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.

Claims

1. A surface mount package comprising:

a first metal layer;

a second metal layer configured to be electrically connected to the first metal layer; and

a ceramic layer between the first and second metal layers, the ceramic layer having an opening therethrough.

2. A surface mount package in accordance with claim 1 wherein the first and second metal layers comprise lead frames.

3. A surface mount package in accordance with claim 1 wherein the second metal layer comprises an opening having generally the same size as the opening of the ceramic layer.

4. A surface mount package in accordance with claim 1 wherein the second metal layer comprises an opening having a larger size than the opening of the ceramic layer.

5. A surface mount package in accordance with claim 1 wherein the first metal layer comprises a gap configured to isolate an input side and an output side of the first layer.

6. A surface mount package in accordance with claim 1 wherein the ceramic layer comprises a plurality of vias.

7. A surface mount package in accordance with claim 1 wherein the second metal layer comprises an opening having a generally circular shape.

8. A surface mount package in accordance with claim 1 wherein a top and bottom surface of the ceramic layer are metallized.

9. A surface mount package in accordance with claim 1 wherein the first metal layer comprises a plurality of anodes and a plurality of cathodes that are electrically isolated.

10. A surface mount package in accordance with claim 1 further comprising a metal portion extending from the first metal layer into the opening of the ceramic layer and configured to mount a surface mount device thereto.

11. A surface mount package in accordance with claim 1 wherein the second metal layer comprises an opening having angled inner walls.

12. A surface mount package in accordance with claim 1 wherein the first metal layer is configured to mount a surface mount device thereto.

13. A surface mount package in accordance with claim 1 further comprising at least one metal pad on a top surface of the ceramic layer and wherein a surface mount device is connected via a wire bond to the at least one metal pad.

14. A surface mount package in accordance with claim 1 wherein the ceramic layer is configured to electrically isolate a first set of terminals and a second set of terminals of the first metal layer.

15. A surface mount package comprising:

a first lead frame;

a second lead frame configured to be electrically connected to the first lead frame; and

a ceramic layer between the first and second lead frames, the ceramic layer configured to electrically isolate a positive side and a negative side of the lead frames.

16. A surface mount package in accordance with claim 15 further comprising an opening in the second lead frame and a corresponding opening in the ceramic layer.

17. A surface mount package in accordance with claim 15 wherein the first lead frame comprises a gap configured to electrically isolate the positive side and the negative side of the lead frames.

18. A method for manufacturing a surface mount package, the method comprising:

providing a first metal layer;

providing a second metal layer electrically connected to the first metal layer; and

providing a ceramic layer between the first and second metal layers, the ceramic layer having an opening therethrough and configured to electrically isolate a positive side from a negative side of the surface mount package.

19. A method in accordance with claim 18 further comprising forming a gap within the first metal layer to electrically isolate the positive side from the negative side.

20. A method in accordance with claim 18 further comprising providing an opening in both the second metal layer and ceramic layer configured to receive a surface mount device for mounting to the surface mount package.