Process analyzer for monitoring electrochemical deposition solutions

• US 20060266648A1
• Filed: 08/10/2006
• Published: 11/30/2006
• Est. Priority Date: 12/17/2002
• Status: Abandoned Application

• Current Assignee: John Staples, Mackenzie E. King
• Original Assignee: John Staples, Mackenzie E. King
• Inventors: Staples, John, King, Mackenzie E.
• Application Number:
  US11/502,278
• Publication Number:
  US 20060266648A1
• Time in Patent Office: Days
• US Class Current: 204/434
• CPC Class Codes: C25D 17/10 Electrodes , e.g. composition, counter electrode
• CPC Class Codes: C25D 17/12 Shape or form C25D17/14 takes precedence
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05

Abstract

The present invention relates to process analyzers and processes employing same for analyzing composition of metal-containing samples such as electrochemical deposition solutions, wherein the analyzer includes at least one microelectrode, e.g. having a radius of not more than about 5 μm. The process analyzer preferably comprises: (1) two or more independent analytical modules, (2) a primary manifold communicatively connected to the analytical modules for introducing fluid samples thereinto, and (3) a computational device communicatively associated with the analytical modules for collecting and processing analytical data therefrom, to permit automatic and simultaneous analysis of multiple sample solutions.

Claims

1. A process analyzer for analyzing composition of at least one meta-containing solution, said process analyzer comprising at least one composite microelectrode having an dielectric layer formed by oxidation of a metal or metal alloy.

2. The process analyzer of claim 1, wherein the microelectrode has a radius of not more than about 5 μ

m.

3. The process analyzer of claim 1, wherein the microelectrode has a radius of not more than about 1 μ

m.

4. The process analyzer of claim 1, wherein the metal or metal alloy of the dielectric layer includes at least one metal selected from the group consisting of tantalum, niobium, zirconium, hafnium, and titanium.

5. The process analyzer of claim 1, wherein the microelectrode has a hemispherical tip.

6. The process analyzer of claim 1, wherein the composite electrode comprises an inner electrically conductive metal core, with the dielectric layer disposed around the metal core.

7. The process analyzer of claim 6, wherein the metal core comprises any of a carbon fiber and a platinum fiber.

8. The process analyzer of claim 1, wherein the microelectrode is non-rotational in relation to other components of said process analyzer.

9. The process analyzer of claim 1, comprising a test electrode, a current source electrode, and a reference electrode, wherein the test electrode comprises the composite microelectrode.

10. The process analyzer of claim 1, further comprising:

one or more analytical modules for analyzing fluid samples; and

a primary manifold communicatively connected to said one or more analytical modules for introducing fluid samples thereinto, the manifold comprising at least one of (i) one or more variable volume displacement pumps;

(ii) one or more face-sealed valves;

(iii) one or more two-way valves and/or three-way valves, and (iv) a make/break plate having pre-manufactured fluid pathways thereon.

11. The process analyzer of claim 10, wherein the one or more analytical modules comprises a plurality of analytical modules, the at least one microelectrode comprises a plurality of microelectrodes, each analytical module has at least one microelectrode of the plurality of microelectrodes.

12. The process analyzer of claim 11, wherein the plurality of analytical modules comprises at least two analytical modules that are independent of one another and adapted to substantially simultaneously analyze at least two metal-containing solutions.

13. The process analyzer of claim 10, wherein the at least one analytical module is selected from the group consisting of Pulsed Cyclic Galvanostatic Analysis (PCGA) modules, spectroscopy modules, potentiometry modules, and Karl Fischer coulometry modules.

14. The process analyzer of claim 10, wherein the process analyzer further comprises a computational device communicatively associated with said one or more analytical modules for collecting and processing analytical data therefrom.

15. The process analyzer of claim 11, wherein the plurality of analytical modules is controlled by one or more microcontrollers, and wherein the primary manifold comprises a serial port for connecting said microcontrollers with a computational device to enable communicative association therebetween.

16. The process analyzer of claim 1, wherein the at least one metal-containing solution comprises an electroplating deposition solution.

17. A process comprising the step of monitoring the composition of at least one metal containing solution utilizing a process analyzer comprising at least one composite microelectrode having a dielectric layer formed by oxidation of a metal or metal alloy.

18. The process of claim 17, wherein the microelectrode has a radius of not more than about 5 μ

m.

19. The process of claim 17, wherein the microelectrode has a radius of not more than about 1 μ

m.

20. The process of claim 17, wherein the metal or metal alloy of the dielectric layer includes at least one metal selected from the group consisting of tantalum, niobium, zirconium, hafnium, and titanium.

21. The process of claim 17, wherein the composite electrode comprises an inner electrically conductive metal core, with the dielectric layer disposed around the metal core.

22. The process of claim 21, wherein the metal core comprises any of a carbon fiber and a platinum fiber.

23. The process of claim 17, wherein the process analyzer further comprises:

one or more analytical modules for analyzing fluid samples; and

a primary manifold communicatively connected to said one or more analytical modules for introducing fluid samples thereinto, the manifold comprising at least one of (i) one or more variable volume displacement pumps;

(ii) one or more face-sealed valves;

(iii) one or more two-way valves and/or three-way valves, and (iv) a make/break plate having pre-manufactured fluid pathways thereon.

24. The process of claim 23, wherein the one or more analytical modules comprises a plurality of analytical modules, the at least one microelectrode comprises a plurality of microelectrodes, and each analytical module has at least one microelectrode of the plurality of microelectrodes.

25. The process of claim 24, wherein the process analyzer further comprises a computational device communicatively associated with said one or more analytical modules for collecting and processing analytical data therefrom.

26. The process of claim 23, further comprising the steps of:

introducing at least one fluid sample into the primary manifold;

analyzing the at least one fluid sample utilizing the one or more analytical modules; and

processing analytical data received from the one or more analytical modules utilizing the computational device.

27. The process of claim 17, wherein the metal-containing solution comprises an electroplating deposition solution.

28. A process comprising the steps of:

supplying a plurality of samples to a process analyzer including a plurality of analytical modules for analyzing fluid samples, each module including at least one microelectrode having a composite structure including an inner electrically conductive metal core, and having an outer dielectric layer formed by oxidization of a metal or metal alloy; and

substantially simultaneously analyzing the plurality of samples using the plurality of analytical modules.

29. The process of claim 28, wherein the at least one microelectrode has a radius of not more than about 5 μ

m.

30. The process of claim 28, wherein the at least one microelectrode has a radius of not more than about 1 μ

m.

31. The process of claim 28, wherein the metal or metal alloy of the dielectric layer includes at least one metal selected from the group consisting of tantalum, niobium, zirconium, hafnium, and titanium.

32. The process of claim 28, wherein the metal core comprises any of a carbon fiber and a platinum fiber.

33. The process of claim 28, wherein the analyzer further comprises a computational device communicatively associated with the plurality of analytical modules, and the process further comprises the step of processing analytical data received from the plurality of analytical modules.

34. The process of claim 28, wherein the analyzer further comprises a primary manifold communicatively connected to said one or more analytical modules for introducing fluid samples thereinto, the manifold comprising at least one of (i) one or more variable volume displacement pumps;

(ii) one or more face-sealed valves;

(iii) one or more two-way valves and/or three-way valves, and (iv) a make/break plate having pre-manufactured fluid pathways thereon.

35. The process of claim 28, wherein the plurality of samples comprises metal-containing solution samples.

36. The process of claim 28, wherein the plurality of samples comprises electroplating deposition solution samples.