Integrated circuit package with air gap
First Claim
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1. An integrated circuit (IC) package, comprising:
- an IC wafer; and
a first portion that is arranged adjacent to said IC wafer;
a second portion that is arranged adjacent to said IC wafer and that is spaced from said first portion, wherein said first and second portions comprise at least one of annealed glass paste (AGP) and epoxy; and
a layer that is arranged adjacent to said first and second portions and that creates an air gap between said layer, said first and second portions and said IC wafer.
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Abstract
An integrated circuit (IC) package comprises an IC wafer. A first portion is arranged adjacent to the IC wafer. A second portion is arranged adjacent to the IC wafer and that is spaced from the first portion. The first and second portions comprise at least one of annealed glass paste (AGP) and epoxy. A layer is arranged adjacent to the first and second portions and creates an air gap between the layer, the first and second portions and the IC wafer.
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Citations
28 Claims
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1. An integrated circuit (IC) package, comprising:
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an IC wafer; and
a first portion that is arranged adjacent to said IC wafer;
a second portion that is arranged adjacent to said IC wafer and that is spaced from said first portion, wherein said first and second portions comprise at least one of annealed glass paste (AGP) and epoxy; and
a layer that is arranged adjacent to said first and second portions and that creates an air gap between said layer, said first and second portions and said IC wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of providing an integrated circuit (IC) package, comprising:
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providing an IC wafer; and
arranging a first portion adjacent to said IC wafer;
arranging a second portion adjacent to said IC wafer and spaced from said first portion, wherein said first and second portions comprise at least one of annealed glass paste (AGP) and epoxy; and
arranging a layer adjacent to said first and second portions, wherein said layer creates an air gap between said layer, said first and second portions and said IC wafer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification