Stackable tier structure comprising prefabricated high density feedthrough
First Claim
1. A stackable tier structure comprising:
- a tier frame comprising an opposing first tier side and second tier side, said tier frame further comprising an integrated circuit die comprising an I/O pad and a feedthrough structure comprising a conductive structure for the routing of an electrical signal between said first tier side and said second tier side, said I/O pad in electrical connection with said conductive structure by means of a conductive trace, and, at least one exposed electrically conductive pad disposed on either of said first or second tier sides in electrical connection with said conductive structure by means of said conductive trace.
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Accused Products
Abstract
A stackable tier structure comprising one or more integrated circuit die and one or more feedthrough structures is disclosed. The I/O pads of the integrated circuit die are electrically rerouted using conductive traces from the first side of the tier structure to a feedthrough structure comprising one ore more conductive structures. The conductive structures electrically route the integrated die pads to predetermined locations on the second side of the tier structure. The predetermined locations, such as exposed conductive pads or conductive posts, in turn, may be interconnected to a second tier structure or other circuitry to permit the fabrication of a three-dimensional microelectronic module comprising one or more stacked tiers.
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Citations
14 Claims
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1. A stackable tier structure comprising:
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a tier frame comprising an opposing first tier side and second tier side, said tier frame further comprising an integrated circuit die comprising an I/O pad and a feedthrough structure comprising a conductive structure for the routing of an electrical signal between said first tier side and said second tier side, said I/O pad in electrical connection with said conductive structure by means of a conductive trace, and, at least one exposed electrically conductive pad disposed on either of said first or second tier sides in electrical connection with said conductive structure by means of said conductive trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A three-dimensional stack of two or more stackable tiers comprising:
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a first stackable tier structure comprised of a first tier frame comprising an opposing first tier side and second tier side, said first tier frame further comprising a first integrated circuit die comprising a first I/O pad and a first feedthrough structure comprising a first conductive structure for the routing of an electrical signal between said first tier side and said second tier side of said first tier frame, said first I/O pad in electrical connection with said first conductive structure by means of a first conductive trace, a first electrically conductive pad disposed on either of said first or second tier sides of said first tier frame in electrical connection with said first conductive structure by means of said first conductive trace, a second stackable tier structure comprised of a second tier frame comprising an opposing first tier side and second tier side, said second tier frame further comprising a second integrated circuit die comprising a second I/O pad and a first feedthrough structure comprising a second conductive structure for the routing of an electrical signal between said first tier side and said second tier side of said second tier frame, said second I/O pad in electrical connection with said second conductive structure by means of a second conductive trace, a second electrically conductive pad disposed on either of said first or second tier sides of said second tier frame in electrical connection with said second conductive structure by means of said second conductive trace, and, means for electrically connecting said first I/O pad with said second I/O pad. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification