Yokeless Hidden Hinge Digital Micromirror Device with Double Binge Layer
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Abstract
A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of four operating layers 12, 13, 14, 15. An addressing layer 12 is fabricated on the substrate. A raised electrode layer 13 is spaced above the addressing layer by an air gap. A hinge layer 14 is spaced above the raised electrode layer 13 by another air gap. A mirror layer 15 is spaced over the hinge layer 14 by a third air gap.
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Citations
19 Claims
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1-14. -14. (canceled)
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15. A method of forming an array of micromirror elements, comprising the steps of:
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depositing a first spacer layer on a substrate;
patterning the first spacer layer to define lower hinge support vias and raised electrode vias;
depositing a raised electrode layer over the first spacer layer;
patterning the raised electrode layer to form at least two raised electrodes associated with each micromirror elements;
depositing a second spacer layer over the patterned raised electrodes;
patterning the second spacer layer to form hinge support vias over the lower hinge support vias;
depositing a hinge layer over the second spacer layer;
patterning the hinge layer to form at least one hinge associated with each micromirror element;
depositing a third spacer layer over the hinge layer;
patterning the third spacer layer to define mirror support vias;
depositing a mirror layer over the third spacer layer;
patterning the mirror layer to form an array of micromirrors; and
removing the first, second, and third spacer layers. - View Dependent Claims (16, 17, 18)
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19-20. -20. (canceled)
Specification