Backlight unit having light emitting diodes and method for manufacturing the same
First Claim
Patent Images
1. A backlight unit having light emitting diodes comprising:
- a substrate disposed thereon with conductive lines;
a plurality of light emitting diodes each bonded to an upper surface of the substrate and spaced a predetermined distance apart from the substrate, and electrically connected to the conductive lines of the substrate;
a transparent resin encompassing the plurality of light emitting diodes and formed on the upper surface of the substrate; and
optical transmission means disposed on an upper surface of the transparent resin, the means including first means for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and second means for diffusing and emitting the light.
2 Assignments
0 Petitions
Accused Products
Abstract
A backlight unit having light emitting diodes and a method for manufacturing the same are disclosed, whereby a hot spot is not generated without recourse to use of a conventional lateral light emitting diode package to enable to improve a picture quality, and the method dispenses with an assembling process of placing a hot spot baffle plate to enable to simplify a manufacturing process of a backlight unit, and to reduce a thickness of the backlight unit.
-
Citations
27 Claims
-
1. A backlight unit having light emitting diodes comprising:
- a substrate disposed thereon with conductive lines;
a plurality of light emitting diodes each bonded to an upper surface of the substrate and spaced a predetermined distance apart from the substrate, and electrically connected to the conductive lines of the substrate;
a transparent resin encompassing the plurality of light emitting diodes and formed on the upper surface of the substrate; and
optical transmission means disposed on an upper surface of the transparent resin, the means including first means for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and second means for diffusing and emitting the light. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- a substrate disposed thereon with conductive lines;
-
14. A backlight unit having light emitting diodes comprising:
- a substrate;
a plurality of light emitting diodes each packaged to an upper surface of and spaced a predetermined distance apart from the substrate;
a guide substrate formed therein with a plurality of through holes each correspondingly positioned to the plurality of light emitting diodes, and bonded to an upper surface of the substrate; and
optical transmission means disposed on an upper surface of the guide substrate, the means including first means for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and second means for diffusing and emitting the light. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
- a substrate;
-
22. A method for manufacturing a backlight unit having light emitting diodes comprising:
- bonding a plurality of light emitting diodes to an upper surface of a substrate where conductive lines are disposed, each diode spaced a predetermined distance apart, and electrically connecting the plurality of light emitting diodes to the conductive lines of the substrate;
encompassing the plurality of light emitting diodes and forming a transparent resin layer on the upper surface of the substrate; and
positioning optical transmission means on an upper surface of the transparent resin layer, the means including first means for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and second means for diffusing and emitting the light. - View Dependent Claims (26)
- bonding a plurality of light emitting diodes to an upper surface of a substrate where conductive lines are disposed, each diode spaced a predetermined distance apart, and electrically connecting the plurality of light emitting diodes to the conductive lines of the substrate;
-
23. A method for manufacturing a backlight unit having light emitting diodes comprising:
- packaging a plurality of light emitting diodes on an upper surface of a substrate, each diode spaced a predetermined distance apart;
preparing a guide plate formed with a plurality of through holes each hole spaced a predetermined distance apart;
bonding to the substrate the guide plate formed with the plurality of through holes so that each light emitting diode can be correspondingly positioned at each inner side of the through holes of the guide plate; and
positioning optical transmission means on an upper surface of the guide substrate, the means including first means for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and second means for diffusing and emitting the light. - View Dependent Claims (24, 25, 27)
- packaging a plurality of light emitting diodes on an upper surface of a substrate, each diode spaced a predetermined distance apart;
Specification