Triple alignment substrate method and structure for packaging devices
First Claim
1. A method of aligning multiple substrates, the method comprising:
- providing a handle substrate;
providing a spacer substrate;
forming a plurality of first alignment marks on a first surface of the handle substrate;
forming a plurality of self-limiting alignment marks on a first surface of the spacer substrate;
forming a plurality of openings in the spacer substrate, each of the plurality of openings surrounded by standoff regions;
aligning the first surface of the handle substrate and the first surface of the spacer substrate using the first alignment marks and the self-limiting alignment marks; and
bonding the handle substrate to the spacer substrate to form a composite substrate structure.
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Accused Products
Abstract
A method for aligning multiple substrates. The method includes providing a handle substrate, providing a spacer substrate, and forming a plurality of first alignment marks on a first surface of the handle substrate. The method also includes forming a plurality of self-limiting alignment marks on a first surface of the spacer substrate and forming a plurality of openings in the spacer substrate, each of the plurality of openings surrounded by standoff regions. The method further includes aligning the first surface of the handle substrate and the first surface of the spacer substrate using the first alignment marks and the self-limiting alignment marks and bonding the handle substrate to the spacer substrate to form a composite substrate structure. In a specific embodiment, the plurality of self-limiting alignment marks and the plurality of openings are formed using an anisotropic wet etching process that preferentially etches the spacer substrate.
73 Citations
24 Claims
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1. A method of aligning multiple substrates, the method comprising:
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providing a handle substrate;
providing a spacer substrate;
forming a plurality of first alignment marks on a first surface of the handle substrate;
forming a plurality of self-limiting alignment marks on a first surface of the spacer substrate;
forming a plurality of openings in the spacer substrate, each of the plurality of openings surrounded by standoff regions;
aligning the first surface of the handle substrate and the first surface of the spacer substrate using the first alignment marks and the self-limiting alignment marks; and
bonding the handle substrate to the spacer substrate to form a composite substrate structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a composite substrate structure, the method comprising:
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providing a handle substrate, a spacer substrate and a device substrate;
forming a plurality of first alignment marks on a first surface of the handle substrate;
forming a plurality of self-limiting alignment marks on a first surface of the spacer substrate;
forming a plurality of openings extending through the spacer substrate, a first set of openings surrounded by standoff regions and a second set of openings defining view windows;
forming a plurality of second alignment marks on a device surface of the device substrate;
aligning the first surface of the handle substrate and the first surface of the spacer substrate using the first alignment marks and the self-limiting alignment marks;
aligning the device surface of the spacer substrate and the device surface of the device substrate using the view windows and the second alignment marks; and
bonding the handle substrate to the spacer substrate and the spacer substrate to the device substrate to form a composite substrate structure. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A spatial light modulator package, the package comprising:
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a transparent substrate comprising an incident light surface and a face surface;
a patterned spacer substrate comprising a spacer face region and a spacer device region, the patterned spacer substrate patterned to form a grid of standoff regions extending from the spacer face region to the spacer device region with a plurality of openings bordered by the grid of standoff regions;
a plurality of first alignment marks on the face surface region of the transparent substrate;
a plurality of self-limiting alignment marks on the spacer face regions of the standoff regions and aligned with the plurality of first alignment marks;
a bond interface formed between the face surface of the transparent substrate and the spacer face regions of the standoff regions;
a device substrate comprising a device surface region and a backside surface region;
a plurality of second alignment marks on the device substrate;
a bond interface formed between the spacer device regions and the device surface of the device substrate; and
a plurality of spatial light modulators coupled to the device surface of the device substrate, each of the plurality of spatial light modulators aligned with one of the plurality of openings in the spacer substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. A method of forming a bonded substrate structure comprising a spacer substrate and a handle substrate, the method comprising:
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forming a plurality of self-terminating alignment marks in a first region of the spacer substrate;
simultaneously forming a plurality of windows in a second region of the spacer substrate, the plurality of windows passing through the spacer substrate; and
using the plurality of alignment marks to align the spacer substrate to the handle substrate. - View Dependent Claims (23, 24)
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Specification