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Module and method for fabricating the same

  • US 20060272150A1
  • Filed: 07/03/2003
  • Published: 12/07/2006
  • Est. Priority Date: 07/03/2003
  • Status: Abandoned Application
First Claim
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1. A module comprising a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components (3A, 3B, 4), said connector and said board being connected to each other through metal leads (7), wherein:

  • (A) the surface of said connector (6) on the side being connected to said board, said metal leads (7), and said electronic components (3A, 3B, 4) are sealed with the same thermosetting resin (9), (B) said thermosetting resin (9) is in solid state at temperatures of 40°

    C. or below before curing, and (C) the thickness of said thermosetting resin (9) sealing said electronic components is changed depending on the heights of said electronic components (3A, 3B, 4).

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