Module and method for fabricating the same
First Claim
1. A module comprising a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components (3A, 3B, 4), said connector and said board being connected to each other through metal leads (7), wherein:
- (A) the surface of said connector (6) on the side being connected to said board, said metal leads (7), and said electronic components (3A, 3B, 4) are sealed with the same thermosetting resin (9), (B) said thermosetting resin (9) is in solid state at temperatures of 40°
C. or below before curing, and (C) the thickness of said thermosetting resin (9) sealing said electronic components is changed depending on the heights of said electronic components (3A, 3B, 4).
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Accused Products
Abstract
A module having a smaller size with enhanced reliability and productivity, and a method for fabricating the module. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components. The connector (6) and the board (1) are connected to each other through metal leads (7). The surface of the connector (6) on the side being connected to the board, the metal leads 7, and the electronic components are sealed with the same thermosetting resin (9). The thermosetting resin (9) is in solid state at temperatures of 40° C. or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic components is changed depending on the heights of the electronic components.
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Citations
14 Claims
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1. A module comprising a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components (3A, 3B, 4), said connector and said board being connected to each other through metal leads (7), wherein:
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(A) the surface of said connector (6) on the side being connected to said board, said metal leads (7), and said electronic components (3A, 3B, 4) are sealed with the same thermosetting resin (9), (B) said thermosetting resin (9) is in solid state at temperatures of 40°
C. or below before curing, and(C) the thickness of said thermosetting resin (9) sealing said electronic components is changed depending on the heights of said electronic components (3A, 3B, 4). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A module comprising a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components, said connector and said board being connected to each other through metal leads (7), wherein:
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(A) the surface of said connector on the side being connected to said board, said metal leads, and said electronic components are sealed with the same thermosetting resin, (B) said thermosetting resin is in solid state at temperatures of 40°
C. or below before curing,(C) the thickness of said thermosetting resin sealing said electronic components is changed depending on the heights of said electronic components, and (D) said connector (6) is disposed perpendicularly to a surface of said board being covered with said thermosetting resin sealing said electronic components or disposed on a surface of said board on the side opposite to the surface covered with said thermosetting resin.
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13. A method for fabricating a module in which a connector (6) having metal terminals for connection, a circuit board (1) mounting electronic components including a BGA or a CSP, and metal leads (7) connecting said connector and said board to each other are molded with a resin, the method comprising the steps of:
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preparing one of a low-pressure transfer molding machine and a compression molding machine with molding pressure of 5-70 kg/cm2 and molding temperature of 150-180°
C., or an injection molding machine with molding pressure of 20-100 kg/cm2 and molding temperature of 150-180°
C.;
preparing thermosetting resin that is in solid state at temperatures of 40°
C. or below before curing;
sealing the surface of said connector on the side being connected to said board, said metal leads, and said electronic components with the same thermosetting resin by using one of said molding machines; and
changing the thickness of said thermosetting resin sealing said electronic components depending on the heights of said electronic components in said sealing step. - View Dependent Claims (14)
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Specification