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Ic tag

  • US 20060273179A1
  • Filed: 05/14/2003
  • Published: 12/07/2006
  • Est. Priority Date: 05/15/2002
  • Status: Active Grant
First Claim
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1. An IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both the electronic circuit and the IC chip being formed on a surface of the first adhesive layer, and a second adhesive layer laminated for covering the electronic circuit and the IC chip, wherein a release agent layer is further formed at positions corresponding to both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer.

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