LED package and method using the same

• US 20060273340A1
• Filed: 09/21/2005
• Published: 12/07/2006
• Est. Priority Date: 06/07/2005
• Status: Abandoned Application

• Current Assignee: Daming Lv, Wei Lian, Xuming Li
• Original Assignee: Daming Lv, Wei Lian, Xuming Li
• Inventors: LV, Daming
• Application Number:
  US11/231,645
• Publication Number:
  US 20060273340A1
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

An LED package including an LED chip (LA, A, B), a sealed transparent envelope (D) containing the LED chip inside, transparent liquid (E) filled in the envelope, electrodes (C) is disclosed. The LED chip comprises a plurality of conductive nodes. The transparent liquid is provided with a high resistance, the resistance of the liquid being higher than on-state resistance of the LED chip. The electrodes are respectively connected with the conductive nodes. The electrodes are extended out from the sealed envelope to be electrically connected with an exterior circuit. A method forming an LED package comprises steps: providing an LED chip, encapsulating the LED chip with a transparent encapsulating envelope; transparent liquid provided with high resistance accommodated in the envelope.

Claims

1. An LED package, comprising:

an LED chip, the LED chip comprising a luminescent transistor and a plurality of conductive nodes;

a sealed transparent or partly transparent envelope, containing the LED chip inside; and

transparent liquid accommodated in the envelope, the liquid provided with high resistance, the resistance of the liquid being much higher than on-state resistance of the LED chip; and

a plurality of electrodes, each electrode connected with one of the conductive nodes, the electrodes joining the conductive nodes extended out from the sealed envelope to be electrically connected with an exterior circuit.

2. The LED package according to claim 1, wherein the LED chip is a straight linear type, and electrodes are respectively extended out from two endpoints of the sealed transparent envelope.

3. The LED package according to claim 1, wherein the LED chip is U shape, and electrodes are simultaneously extended out from the sealed transparent envelope by the same side.

4. The LED package according to claim 1, wherein a fluorescent layer is combined to the sealed transparent envelope, covering the exterior surface of the envelope, or sticking to the interior surface of the envelope, or material of the transparent envelope is compounded with fluorescent dosage, or the fluorescent layer is sandwiched in the envelope of the package.

5. The LED package according to claim 1, wherein a reflector layer sticks to the envelope under the surface interiorly or over the surface exteriorly thereof, or is sandwiched in the envelope, with different angles or directions according to light intensity.

6. The LED package according to claim 1, wherein the transparent liquid fills the envelope.

7. The LED package according to claim 1, wherein the sealed envelope is transparent.

8. The LED package according to claim 7, wherein the sealed transparent envelope of the package is sphere type, elliptic type, or cylindrical type.

9. A method of forming an LED package comprising:

providing an LED chip, the LED chip comprising a plurality of conductive nodes, each conductive node connected with an electrode;

encapsulating the LED chip with a transparent or partly transparent encapsulating envelope;

providing a transparent liquid with high resistance in the envelope, wherein the resistance of the liquid is higher than on-state resistance of the LED chip; and

joining the electrodes with the conductive nodes extended out from the encapsulating envelope.