Electronic circuit protection device
First Claim
Patent Images
1. A device for protecting an electronic circuit that includes a support to which are attached at least two circuit portions, each including at least one integrated circuit chip, comprising:
- a wafer of a semiconductor material;
a conductive layer arranged parallel to the support and covering a surface of the wafer; and
conductive pillars connecting the wafer to the support, the conductive pillars being distributed around each circuit portion and in contact with the conductive layer.
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Abstract
A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.
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Citations
20 Claims
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1. A device for protecting an electronic circuit that includes a support to which are attached at least two circuit portions, each including at least one integrated circuit chip, comprising:
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a wafer of a semiconductor material;
a conductive layer arranged parallel to the support and covering a surface of the wafer; and
conductive pillars connecting the wafer to the support, the conductive pillars being distributed around each circuit portion and in contact with the conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing electronic circuits, comprising the steps of:
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providing a planar support;
attaching on a surface of the support circuit portions, each containing at least one integrated circuit chip;
attaching, parallel to said surface of the support, wafer portions of a semiconductor material, each wafer portion covering at least two adjacent circuit portions, being covered with a metal layer on the side of said at least two adjacent circuit portions, and being connected to the support by conductive pillars distributed around each of said at least two adjacent circuit portions; and
delimiting electronic circuits, each comprising at least two adjacent circuit portions and the associated wafer portion. - View Dependent Claims (9, 10, 11, 12)
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13. A protected electronic device, comprising:
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a support;
first and second circuit portions positioned on the support, each circuit portion including at least one integrated circuit chip;
a wafer;
a conductive layer arranged parallel to the support and covering a surface of the wafer; and
conductive pillars connecting the wafer to the support, the conductive pillars being distributed around each circuit portion and in contact with the conductive layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification