Co-planar surface and torsion device mirror structure and method of manufacture for optical displays

• US 20060274397A1
• Filed: 06/01/2005
• Published: 12/07/2006
• Est. Priority Date: 06/01/2005
• Status: Active Grant

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Yang, Xiao
• Granted Patent: US 7,298,539 B2
• Time in Patent Office: Days
• US Class Current: 359/245
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2203/0181 See-saws
• CPC Class Codes: B81C 1/00174 See-saws
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A spatial light modulator is provided. The spatial light modulator includes a first substrate comprising a plurality of electrically activated electrodes and a bias grid and a standoff structure coupled to the first substrate. The standoff structure includes a central portion projecting to a first height above the first substrate and an extension portion projecting to a second height above the first substrate, the second height being less than the first height. The spatial light modulator also includes a mirror plate comprising a central contact structure integrally formed with the central portion of the standoff structure, a torsion beam coplanar with the central contact structure and free from contact with the standoff structure, and a reflective surface coupled to the plurality of torsion arms and free from contact with the standoff structure.

Claims

1. A spatial light modulator, the spatial light modulator comprising:

a first substrate comprising a plurality of electrically activated electrodes and a bias grid;

a standoff structure coupled to the first substrate, the standoff structure comprising;

a central portion projecting to a first height above the first substrate, and

an extension portion projecting to a second height above the first substrate, the second height being less than the first height; and

a mirror plate comprising;

a central contact structure integrally formed with the central portion of the standoff structure,

a torsion beam coplanar with the central contact structure and free from contact with the standoff structure, and

a reflective surface coupled to the torsion beam and free from contact with the standoff structure.

2. The spatial light modulator of claim 1 wherein the central portion of the standoff structure comprises a body section extending from the first substrate to the mirror plate.

3. The spatial light modulator of claim 2 wherein the bias grid is electrically coupled to the mirror plate by a via passing through the body section of the central portion of the standoff structure.

4. The spatial light modulator of claim 2 wherein the standoff structure and the mirror plate are formed from a single piece of material.

5. The spatial light modulator of claim 4 wherein the single piece of material is single crystal silicon.

6. The spatial light modulator of claim 1 wherein the standoff structure is coupled to the first substrate by a substrate bonding process.

7. The spatial light modulator of claim 1 wherein the standoff structure is coupled to the first substrate at a location between a pair of complementary electrodes.

8. The spatial light modulator of claim 1 wherein the torsion beam comprises a plurality of torsion arms extending in opposite directions from the central contact structure.

9. The spatial light modulator of claim 8 wherein the plurality of torsion arms extend along a diagonal direction with respect to the mirror plate.

10. A micro-mirror flexibly supported by a standoff structure, the micro-mirror comprising:

a mirror layer having an upper surface adapted to reflect incident radiation and a lower surface opposite the upper surface;

a first portion of the standoff structure integrally formed with the mirror layer comprising;

a first planar interface coupled to the lower surface of the mirror layer;

a second planar interface opposite the first planar interface; and

a body section extending along a first axis from the first planar interface to the second planar interface;

a second portion of the standoff structure extending along a second axis perpendicular to the first axis, the second portion comprising;

an upper surface physically separated from the plane of the first planar interface by a first distance;

a lower surface coplanar with the second planar interface; and

a body section extending along the first axis; and

a substrate coupled to the second planar interface of the first portion of the standoff structure and to the lower surface of the second portion of the standoff structure.

11. The micro-mirror of claim 10 wherein the mirror layer and the first portion of the standoff structure are fabricated from a single piece of material.

12. The micro-mirror of claim 10 wherein the upper surface of the second portion of the standoff structure is physically separated from the plane of the first planar interface by an etching process.

13. The micro-mirror of claim 12 wherein the etching process is an anisotropic etching process.

14. The micro-mirror of claim 10 wherein the mirror layer comprises a central support region and a plurality of torsion arms coupled to the central support region.

15. A method of fabricating a spatial light modulator, the method comprising:

providing a first substrate structure comprising a plurality of layers;

forming a standoff structure in a first layer selected from the plurality of layers of the first substrate structure;

providing a second substrate comprising a bonding surface and a support surface;

joining the standoff structure to the bonding surface of the second substrate;

removing at least a second layer selected from the plurality of layers of the first substrate structure;

selectively patterning the first layer of the first substrate structure to form a micro-mirror; and

selectively patterning the first layer to remove a portion of the standoff structure and form a torsion spring hinge co-planar with the micro-mirror.

16. The method of claim 15 wherein selectively patterning the first layer comprises etching the first layer.

17. The method of claim 16 wherein etching comprises a dry etch process.

18. The method of claim 15 wherein the first substrate structure comprises a silicon on insulator substrate.

19. The method of claim 15 wherein the first layer selected from the plurality of layers of the first substrate structure is a silicon layer.

20. The method of claim 15 wherein the second layer selected from the plurality of layers of the first substrate structure is an insulator layer.

21. The method of claim 15 wherein selectively patterning the first layer of the first substrate structure to form a micro-mirror and selectively patterning the first layer to remove a portion of the standoff structure are initially performed simultaneously.

22. The method of claim 15 wherein the standoff structure is formed substantially in the shape of an “

H”

when viewed in a direction orthogonal to the micro-mirror.