CMOS image sensor and method for fabricating the same
First Claim
1. A CMOS (complementary metal oxide silicon) image sensor, comprising:
- one or more photodiodes formed on a substrate at a regular interval;
an interlayer insulating layer formed on the substrate;
one or more trenches formed in the interlayer insulating layer at predetermined locations corresponding to the one or more photodiodes;
a color filter layer formed in each of the one or more trenches; and
one or more microlenses formed on the resulting substrate.
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Abstract
A CMOS image sensor and a method of fabricating the same are provided. The CMOS image sensor can incorporate one or more photodiodes formed on a substrate at a regular interval, an interlayer insulating layer formed on the substrate; one or more trenches in the interlayer insulating layer at predetermined locations corresponding to the photodiodes, a color filter layer formed in each of the trenches; and at least one microlens corresponding to a color filter layer formed on the resulting substrate. The sensitivity of the CMOS image sensor is improved by reducing the thickness of the CMOS image sensor by forming the trenches in the interlayer insulating layer and forming the color filters in the trenches.
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Citations
20 Claims
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1. A CMOS (complementary metal oxide silicon) image sensor, comprising:
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one or more photodiodes formed on a substrate at a regular interval;
an interlayer insulating layer formed on the substrate;
one or more trenches formed in the interlayer insulating layer at predetermined locations corresponding to the one or more photodiodes;
a color filter layer formed in each of the one or more trenches; and
one or more microlenses formed on the resulting substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating a CMOS image sensor, comprising:
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forming one or more photodiodes on a substrate at a regular interval;
forming an interlayer insulating layer on the substrate having the one or more photodiodes;
forming one or more trenches in the interlayer insulating layer corresponding to the one or more photodiodes;
forming a color filter layer in each of the one or more trenches; and
forming one or more microlenses on the resulting substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification