Systems and methods for plasma etching
First Claim
Patent Images
1. A method for processing a semiconductor substrate, comprising:
- depositing a conductive layer on the substrate;
patterning a set of insulating structures on the substrate;
selectively back-biasing the substrate;
depositing a layer of material on the substrate; and
removing a part of the conductive layer selectively biased to attract cation bombardment.
2 Assignments
0 Petitions
Accused Products
Abstract
Systems and methods are disclosed for processing a semiconductor substrate by depositing a conductive layer on the substrate; patterning a set of insulating structures on the substrate; selectively back-biasing the substrate; depositing a layer of material on the substrate; and removing a part of the conductive layer selectively biased to attract cation bombardment.
-
Citations
20 Claims
-
1. A method for processing a semiconductor substrate, comprising:
-
depositing a conductive layer on the substrate;
patterning a set of insulating structures on the substrate;
selectively back-biasing the substrate;
depositing a layer of material on the substrate; and
removing a part of the conductive layer selectively biased to attract cation bombardment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
-
14. A face target sputtering apparatus to fabricate semiconductors, comprising:
-
an air-tight chamber in which an inert gas is admittable and exhaustible;
a pair of target plates placed at opposite ends of said air-tight chamber respectively so as to face each other and form a plasma region therebetween;
a pair of magnets respectively disposed adjacent to said target plates such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field of said plasma region between said target plates;
a substrate holder disposed adjacent to said plasma region, said substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited; and
a back-bias power supply coupled to the substrate holder, wherein the substrate is selectively back-biased prior to face target sputtering with a metal to form a pattern on the layer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
Specification