Implantable microstimulator with external electrodes disposed on a film substrate and methods of manufacture and use

• US 20060276842A1
• Filed: 06/01/2005
• Published: 12/07/2006
• Est. Priority Date: 06/01/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: He, Tom Xiaohai
• Granted Patent: US 7,957,805 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators

Abstract

An implantable microstimulator includes a housing, an electronic subassembly, conductive vias, and an electrode arrangement. The housing defines an interior and an exterior with the electronic subassembly disposed in the interior of the housing. The conductive vias extend from the interior to the exterior of the housing. The electrode arrangement is disposed on the housing and includes a film substrate with electrodes disposed on the film substrate and coupled to the electronic subassembly through the plurality of vias.

Claims

1. An implantable microstimulator, comprising:

a housing defining an interior and an exterior;

an electronic subassembly disposed in the interior of the housing;

a plurality of conductive vias extending from the interior to the exterior of the housing; and

an electrode arrangement disposed on the housing and comprising a film substrate and a plurality of electrodes disposed on the film substrate and coupled to the electronic subassembly through the plurality of vias.

2. The implantable microstimulator of claim 1, wherein the electrode arrangement further comprises a plurality of conductors and a plurality of contact pads disposed on the film substrate, the conductors coupling the electrodes to the contact pads.

3. The implantable microstimulator of claim 2, wherein the electrode arrangement further comprises a second film substrate disposed over at least a portion of the conductors.

4. The implantable microstimulator of claim 2, wherein the contact pads are exposed through the film substrate.

5. The implantable microstimulator of claim 1, wherein the vias comprise a capture pad disposed over a conductive channel through the housing.

6. The implantable microstimulator of claim 1, wherein the housing is non-cylindrical.

7. The implantable microstimulator of claim 6, wherein the film substrate is disposed on at least two opposing sides of the housing.

8. The implantable microstimulator of claim 7, wherein the plurality of electrodes are disposed on each of the at least two opposing sides of the housing.

9. The implantable microstimulator of claim 1, further comprising a support member coupled to the housing and disposed over the substrate and vias and applying pressure to the substrate to maintain the electrical contact between the vias and contact pads.

10. An implantable device, comprising:

a housing defining an interior and an exterior;

an electronic subassembly disposed in the interior of the housing;

a plurality of conductive vias extending from the interior to the exterior of the housing;

a film substrate having a plurality of contact pads in electrical contact with the plurality of vias; and

a support member coupled to the housing and disposed over the substrate and the vias, the support member applying pressure to the substrate to maintain the electrical contact between the vias and the contact pads.

11. The implantable device of claim 10, wherein the support member comprises a bridge that extends from portions of the housing on opposite sides of the film substrate and a pressure member disposed between the bridge and the substrate.

12. The implantable device of claim 11, wherein the pressure member comprises a compressible material.

13. The implantable device of claim 11, wherein the bridge is metal and the housing comprises an annular metal endcap to which the bridge is welded.

14. The implantable device of claim 10, wherein the housing comprises a ceramic piece through which the vias are disposed.

15. The implantable device of claim 10, wherein the housing comprises a first end and the vias are disposed at the first end of the housing.

16. A method of making an implantable microstimulator, the method comprising:

placing an electronic subassembly into a non-conductive housing;

forming a plurality of conductive vias through the housing;

forming a plurality of electrodes, conductors, and contact pads on a film substrate, the conductors coupling the electrodes to the contact pads;

disposing the film substrate on the housing with the contact pads in electrical communication with the vias; and

coupling the electronic subassembly to the conductive vias.

17. The method of claim 16, further comprising disposing a support member over the substrate and vias and applying pressure to the substrate to maintain the electrical contact between the vias and contact pads.

18. The method of claim 17, further comprising coupling the support member to the housing.

19. The method of claim 16, further comprising placing a second film substrate over the film substrate and at least a portion of the conductors.

20. The method of claim 16, wherein disposing the film substrate on the housing comprises disposing the film substrate on the housing with electrodes disposed on opposing sides of the housing.