LED wafer-level chip scale packaging
First Claim
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1. A light emitting diode (LED) wafer-level chip scale packaging, comprising:
- an LED with a positive electrode and a negative electrode disposed on one side thereof; and
a carrier substrate having at least one through hole, which is filled with thermally conductive material, wherein the positive electrode and the negative electrode of said LED are attached to a first surface of said carrier substrate.
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Abstract
A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die and its carrier substrate. The CSP structure is achieved by bonding pre-processed through-hole-filling carrier substrate against the flip-chip LED wafer.
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Citations
29 Claims
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1. A light emitting diode (LED) wafer-level chip scale packaging, comprising:
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an LED with a positive electrode and a negative electrode disposed on one side thereof; and
a carrier substrate having at least one through hole, which is filled with thermally conductive material, wherein the positive electrode and the negative electrode of said LED are attached to a first surface of said carrier substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for light emitting diode (LED) wafer-level chip scale packaging, comprising:
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providing a carrier substrate and an LED, said LED having a positive electrode and a negative electrode disposed on one side thereof;
forming at least one through hole in said carrier substrate, said through hole passing through between a first surface and a second surface of said carrier substrate;
filling the through hole with thermally conductive material; and
attaching the positive electrode and the negative electrode of said LED to the first surface of said carrier substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A light emitting diode (LED) device, comprising:
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at least one LED wafer-level chip scale packaging, each comprising;
an LED with a positive electrode and a negative electrode disposed on one side thereof;
a carrier substrate having at least one through hole, which is filled with thermally conductive material, wherein the positive electrode and the negative electrode of said LED are attached to a first surface of said carrier substrate; and
at least one package-to-board connection coupled to a second surface of said carrier substrate and contacted with the filled through hole, thereby heat generated from said LED is conducted to said package-to-board connection by way of the filled through hole; and
a board bonded to said LED wafer-level chip scale packaging through the package-to-board connection. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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Specification