Stereo in mold transfer printing method of silicone

• US 20060279015A1
• Filed: 06/13/2005
• Published: 12/14/2006
• Est. Priority Date: 06/13/2005
• Status: Abandoned Application

• Current Assignee: Ching-Shing Wang
• Original Assignee: Ching-Shing Wang
• Inventors: Wang, Ching-Shing
• Application Number:
  US11/150,158
• Publication Number:
  US 20060279015A1
• Time in Patent Office: Days
• US Class Current: 264/132
• CPC Class Codes: B29C 45/14688 Coating articles provided with a decoration
• CPC Class Codes: B29C 45/14827 using a transfer foil detachable from the insert

Abstract

Disclosed is a stereo transfer printing method of in mold transfer printing concurs with injection molding of silicone. The stereo in mold transfer printing method of silicone includes the following steps: (a) providing ink mixed with silicone; (b) using the silicone containing ink to print text or graphic needed on the substrate film; (c) positioning the text or graphic on the substrate film between the mold dies; (d) closing and locking the mold; (e) injecting the silicone; and (f) opening the mold and getting the silicone product.

Claims

1. A stereo in mold transfer printing method of silicone, comprising steps:

(a) providing ink mixed with silicone;

(b) using the silicone containing ink to print text or graphic needed on the substrate film;

(c) positioning the text or graphic on the substrate film between the mold dies;

(d) closing and locking the mold;

(e) injecting the silicone; and

(f) opening the mold and getting the silicone product

2. The method as claimed in claim 1, wherein the substrate film is rolled by two rollers to continuously proceed with the transfer printing of next text or graphic after the transfer printing of a text or graphic.

3. The method as claimed in claim 1, wherein the mold dies further comprise a heating equipment.

4. The method as claimed in claim 3, wherein step (e) is to process heating after feeding the mold die with solid silicone.

5. The method as claimed in claim 3, wherein step (e) is to process heating after feeding the mold die with liquid silicone.