Conductive pattern and method of making

• US 20060283005A1
• Filed: 08/25/2006
• Published: 12/21/2006
• Est. Priority Date: 04/11/2003
• Status: Abandoned Application

• Current Assignee: Andrew W. Holman, Ian J. Forster, Jaime C. Grunlan, James P. Coleman, Peikang Liu, Scott Wayne Ferguson
• Original Assignee: Andrew W. Holman, Ian J. Forster, Jaime C. Grunlan, James P. Coleman, Peikang Liu, Scott Wayne Ferguson
• Inventors: Forster, Ian J., Ferguson, Scott Wayne, Coleman, James P., Grunlan, Jaime C., Holman, Andrew W., Liu, Peikang
• Application Number:
  US11/509,862
• Publication Number:
  US 20060283005A1
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
• CPC Class Codes: H05K 2203/1469 Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Claims

1. A method of making a conductive pattern, the method comprising:

placing a pre-formed solid mask dielectric layer, with pre-formed openings therethrough, on a conductive substrate;

plating the conductive pattern atop the conductive substrate, through the openings; and

separating the conductive pattern from the conductive substrate.

2. The method of claim 1, wherein the dielectric layer is made from a polymer material.

3. The method of claim 1, wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.

4. The method of claim 1, wherein the plating includes plating directly onto the conductive substrate.

5. The method of claim 1, further comprising, prior to the plating, roughening at least part of the conductive substrate.

6. The method of claim 1,

further comprising, prior to,the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;

wherein the plating includes plating onto the conductive ink layer.

7. The method of claim 1, wherein the separating includes:

depositing an adhesive layer on the conductive pattern; and

using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.

8. A method of making a conductive pattern, the method comprising:

printing a patterned dielectric layer on a conductive substrate, wherein the patterned dielectric layer has openings therethrough;

plating the conductive pattern atop the conductive substrate, through the openings; and

separating the conductive pattern from the conductive substrate.

9. The method of claim 8, wherein the printing includes printing a curable material.

10. The method of claim 9, further comprising curing the curable material of the dielectric layer prior to the plating.

11. The method of claim 8, wherein the plating includes plating directly onto the conductive substrate.

12. The method of claim 8, further comprising, prior to the plating, roughening at least part of the conductive substrate.

13. The method of claim 8,

further comprising, prior to the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;

wherein the plating includes plating onto the conductive ink layer.

14. The method of claim 8, wherein the separating includes:

depositing an adhesive layer on the conductive pattern; and

using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.

15. The method of claim 8, wherein the printing includes printing directly onto the conductive substrate.

16. A method of making a conductive pattern, the method comprising:

placing a dielectric layer on a conductive substrate, wherein the dielectric layer has openings therethrough;

plating the conductive pattern atop the conductive substrate, through the openings; and

separating the conductive pattern from the conductive substrate;

wherein the separating includes;

depositing an adhesive layer on the conductive pattern; and

using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.

17. The method of claim 16, wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.

18. The method of claim 16, wherein the plating includes plating directly onto the conductive substrate.

19. The method of claim 16, further comprising, prior to the plating, roughening at least part of the conductive substrate.

20. The method of claim 16,

further comprising, prior to the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;

wherein the plating includes plating onto the conductive ink layer.