Power converter and semiconductor device mounting structure
First Claim
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1. An electric power converter comprising:
- a main circuit section having a semiconductor module and a cooling device, wherein the semiconductor module constitutes a part of an electric power converter circuit, and wherein the cooling device cools the semiconductor module;
a control circuit substrate section having a control circuit electrically connected to a signal terminal of the semiconductor module and controlling the semiconductor module; and
a power wiring section connected to a main electrode terminal of the semiconductor module and inputting/outputting current to the semiconductor module, wherein the main circuit section is disposed between the control circuit substrate section and the power wiring section.
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Abstract
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
86 Citations
16 Claims
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1. An electric power converter comprising:
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a main circuit section having a semiconductor module and a cooling device, wherein the semiconductor module constitutes a part of an electric power converter circuit, and wherein the cooling device cools the semiconductor module;
a control circuit substrate section having a control circuit electrically connected to a signal terminal of the semiconductor module and controlling the semiconductor module; and
a power wiring section connected to a main electrode terminal of the semiconductor module and inputting/outputting current to the semiconductor module, wherein the main circuit section is disposed between the control circuit substrate section and the power wiring section. - View Dependent Claims (2, 3, 4, 5)
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6. A mounting structure of a semiconductor device, the structure comprising:
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a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and
a first and a second holding members having electric conductivity for holding the semiconductor module from both sides of the semiconductor module through a first and a second insulation members as a dielectric member, wherein the first or second electrode plate, the first or second holding member, the first or second insulation member provide a bypass capacitor for reducing noise. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A mounting structure of a semiconductor device, the structure comprising:
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a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and
a first and a second holding members as a dielectric member having electric insulation for holding the semiconductor module from both sides of the semiconductor module and including a first and a second electrically conductive inner members inserted into the first and the second holding members, respectively, wherein the first or second electrode plate, the first or second inner member, wall portion of the first or second holding member provide a bypass capacitor for reducing noise. - View Dependent Claims (13, 14)
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15. A mounting structure of a semiconductor device, the structure comprising:
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a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and
a metallic casing accommodating cooling medium having electric conductivity, wherein a plurality of the semiconductor modules is proximally disposed in the cooling medium of the casing, wherein the first or second electrode plate, the cooling medium, a first or second mold portion of the resin mold provide a bypass capacitor for reducing noise. - View Dependent Claims (16)
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Specification