Low-loss microstrip transmission line structure and a method for its implementation
First Claim
1. A microstrip structure, comprising an electrically conductive microstrip, and an electrically conductive ground plane;
- the microstrip structure being integrated into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein the electrically conductive microstrip is an integral part of the electrical part, and the electrically conductive ground plane is an integral part of the base plate.
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Accused Products
Abstract
A signal carrying microstrip (510) is an integral part of the passive part (502) or the active part (501) of an RF-IC (integrated circuit carrying radio frequency signals). The ground plane (511) is an integral part of the base plate (503) of an RF-IC. The distance (h) between the microstrip (510) and the ground plane (511) is determined by the geometrical properties of the passive or the active part, of the base plate, and of the elements that act as spacers between the passive or active part and the base plate. The inventive microstrip structure allows the use of microstrips with different widths in an RF-IC without compromising the other important electrical characteristics like impedance level and inductive coupling. This opens the door for constructing a balun integrated into an RF-IC being able to e.g. make an impedance matching between different impedance levels.
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Citations
39 Claims
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1. A microstrip structure, comprising
an electrically conductive microstrip, and an electrically conductive ground plane; -
the microstrip structure being integrated into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein the electrically conductive microstrip is an integral part of the electrical part, and the electrically conductive ground plane is an integral part of the base plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A balanced to unbalanced transformer, hereinafter balun, comprising
an electrical conductor forming a signal input side of the balun, and an electrical conductor forming a signal output side of the balun, and an electrically conductive ground plane common for both the signal input side and the signal output side; -
the balun being integrated into an integrated circuit comprising a base plate and a passive part for passive electrical elements, wherein the electrical conductor forming the signal input side is an electrically conductive microstrip that is an integral part of the passive part, and the electrical conductor forming the signal output side is an electrically conductive microstrip that is an integral part of the passive part, and the electrically conductive ground plane is an integral part of the base plate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A power amplifier having components in an active part of an RF-IC, in a passive part of an RF-IC, and in a base plate of an RF-IC, comprising
a push-pull type active stage located in the active part of an RF-IC, and conductors between the active part and the passive part of an RF-IC, and a balun comprising an electrical conductor forming a signal input side of the balun, an electrical conductor forming a signal output side of the balun, and an electrically conductive ground plane of the balun common for both the signal input side and the signal output side; -
wherein the electrical conductor forming the signal input side of the balun is an electrically conductive microstrip that is an integral part of the passive part, and the electrical conductor forming the signal output side of the balun is an electrically conductive microstrip that is an integral part of the passive part, and the electrically conductive ground plane of the balun is an integral part of the base plate. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method for implementing a microstrip structure into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein the method comprises
mounting an electrically conductive microstrip into the electrical part, and mounting an electrically conductive ground plane into the base plate, and assembling the electrical part and the base plate together in a way that an imaginary line that is normal to the electrically conductive microstrip is substantially normal to the electrically conductive ground plane, and the electrically conductive microstrip and the electrically conductive ground plane are at least partially overlapping when seen along the direction of the imaginary normal line.
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31. A mobile phone, comprising a mictrostrip structure having
an electrically conductive microstrip, and an electrically conductive ground plane, and being integrated into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein the electrically conductive microstrip is an integral part of the electrical part, and the electrically conductive ground plane is an integral part of the base plate.
Specification