Reticle alignment technique
First Claim
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1. A method, comprising:
- forming a first patterned layer with a first alignment grid;
forming sidewall layers over the first patterned layer to perform a first shrink;
etching the first alignment grid after shrink into an etch layer to form an etched first alignment grid;
removing the patterned layer;
measuring an optical pattern of a second alignment grid aligned over the etched first alignment grid; and
using the optical pattern to determine whether the second alignment grid is aligned over the etched first alignment grid.
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Abstract
A method for aligning a reticle is provided. A first patterned layer with a first alignment grid is formed. Sidewall layers are formed over the first patterned layer to perform a first shrink. The first alignment grid after shrink is etched into an etch layer to form an etched first alignment grid. The patterned layer is removed. An optical pattern of a second alignment grid aligned over the etched first alignment grid is measured. The optical pattern is used to determine whether the second alignment grid is aligned over the etched first alignment grid.
23 Citations
20 Claims
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1. A method, comprising:
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forming a first patterned layer with a first alignment grid;
forming sidewall layers over the first patterned layer to perform a first shrink;
etching the first alignment grid after shrink into an etch layer to form an etched first alignment grid;
removing the patterned layer;
measuring an optical pattern of a second alignment grid aligned over the etched first alignment grid; and
using the optical pattern to determine whether the second alignment grid is aligned over the etched first alignment grid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for forming devices on a wafer using a plurality of masks, comprising:
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a) forming a first patterned layer for a plurality of dice on a wafer, wherein each die of the plurality of dice has a first alignment grid;
b) forming sidewall layers over the first patterned layer to perform a first shrink;
c) etching the features formed by the first pattern layer and first alignment grid after shrink into an etch layer to form an etched first alignment grid for each dye of the plurality of dice;
d) removing the mask from the patterned layer;
e) forming a photoresist layer over the wafer;
f) placing the wafer in a photolithographic tool;
g) stepping a reticle to a die of the plurality of dice;
h) measuring an optical pattern of a second alignment grid of the reticle aligned over an etched first alignment grid of the stepped to die;
i) using the optical pattern to determine whether the second alignment grid is aligned over the etched first alignment grid of the stepped to die;
j) adjusting the photolithographic tool until the optical pattern of the second alignment grid is aligned over the etched first alignment grid after of the stepped to die;
k) exposing the photoresist above the stepped to die;
j) stepping to another die and returning to step h, until all of the dice of the plurality of dice are stepped to. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification