Quatum tunnelling transducer device

• US 20060285789A1
• Filed: 04/22/2004
• Published: 12/21/2006
• Est. Priority Date: 04/22/2003
• Status: Active Grant

• Current Assignee: Chemtron Research LLC (Intellectual Ventures LLC)
• Original Assignee: Pilsne Research Co LLC (Intellectual Ventures LLC)
• Inventors: Michalewicz, Marek, Rymuza, Zygmunt
• Granted Patent: US 8,033,091 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: B81B 2201/0285 Vibration sensors
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: G01C 19/00 Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
• CPC Class Codes: G01D 21/00 Measuring or testing not otherwise provided for
• CPC Class Codes: G01P 15/0894 by non-contact electron transfer, i.e. electron tunneling
• CPC Class Codes: Y10S 977/724 Devices having flexible or movable element
• CPC Class Codes: Y10S 977/725 Nanomotor/nanoactuator
• CPC Class Codes: Y10S 977/732 Nanocantilever
• CPC Class Codes: Y10S 977/733 Nanodiaphragm

Abstract

A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state hinge means (30, 32) integral with and linking the substrates to relatively locate the substrates so that respective elongate electrical conductors (40) of the substrates are opposed at a spacing that permits a detectable quantum tunnelling current between the conductors when a suitable electrical potential difference is applied across the conductors. The solid state hinge means permits relative parallel translation of the substrates transverse to the elongate electrical conductors.

Claims

1. A monolithic micro or nano electromechanical transducer device including:

a pair of substrates respectively mounting one or more elongate electrical conductors; and

resilient solid state hinge means integral with and linking said substrates to relatively locate the substrates so that respective said elongate electrical conductors of the substrates are opposed at a spacing that permits a detectable quantum tunnelling current between the conductors when a suitable electrical potential difference is applied across the conductors;

wherein said solid state hinge means permits relative parallel translation of said substrates transverse to said elongate electrical conductors.

3. An electromechanical transducer device according to claim 1 or 2, wherein said resilient solid state hinge means is dimensioned to have a substantially lower stiffness in a selected direction relative to a direction orthogonal to the selected direction.

4. An electromechanical transducer device according to claim 1, 2 or 3 wherein said solid state hinge means comprises at least one outstanding pillar or post from one of said substrates and a web integrally joining the pillar to an edge region of the other substrate.

5. An electromechanical transducer device according to any preceding claim wherein, for detecting linear translation, said hinge means comprises a pair of said resilient solid state hinges.

6. An electromechanical transducer device according to claim 5, wherein said hinges include hinges webs in mutual co-planar alignment.

7. An electromechanical transducer device according to any one of claims 1 to 4 wherein, for detection of rotational or angular translation motion, said hinge means comprises one or more angularly spaced solid state hinges.

8. An electromechanical transducer device according to any one of claims 1 to 7, wherein the respective substrates are planar plates or wafers, one overlying the other.

9. An electromechanical transducer device according to claim 8 wherein said plates or wafers are rectangular.

2. An electromechanical transducer device according to claim 2, wherein the opposed elongate electrical conductors mounted on the respective substrates are substantially parallel.