Fabricating method for flat panel display device

• US 20060286699A1
• Filed: 10/28/2005
• Published: 12/21/2006
• Est. Priority Date: 06/17/2005
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Chae, Gee Sung, Park, Mi Kyung
• Granted Patent: US 7,387,971 B2
• Time in Patent Office: Days
• US Class Current: 438/30
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1292 using liquid deposition, e.g. printing

Abstract

A fabricating method for a flat panel display device having a thin film pattern over a substrate is disclosed. The fabricating method includes depositing a hydrophilic resin over a substrate and patterning the hydrophilic resin to form hydrophilic resin patterns over areas outside where thin film patterns are to be formed over the substrate. The fabricating method also includes depositing a hydrophobic nano powder thin film material over the substrate and between the hydrophilic resin patterns and removing the hydrophilic resin patterns to form hydrophobic nano powder thin film patterns over the substrate. Moreover, the fabricating method includes treating the hydrophobic nano powder thin film patterns to form the thin film pattern.

Claims

1. A fabricating method for a flat panel display device having a thin film pattern over a substrate, the method comprising the steps of:

depositing a hydrophilic resin over a substrate;

patterning the hydrophilic resin to form hydrophilic resin patterns over areas outside where thin film patterns are to be formed over the substrate;

depositing a hydrophobic nano powder thin film material over the substrate and between the hydrophilic resin patterns;

removing the hydrophilic resin patterns to form hydrophobic nano powder thin film patterns over the substrate; and

treating the hydrophobic nano powder thin film patterns to form the thin film pattern.

2. The fabricating method according to claim 1, wherein the step of patterning the hydrophilic resin includes the steps of:

placing a soft mold on the hydrophilic resin, the soft mold having projections aligned with areas where the thin film pattern is to be formed;

applying pressure on areas of the hydrophilic resin under the projections of the soft mold to make the projections of the soft mold to come in contact with a layer underlying the hydrophilic resin; and

removing the soft mold.

3. The fabricating method according to claim 2, wherein the layer underlying the hydrophilic resin is the substrate.

4. The fabricating method according to claim 2, wherein the step of applying pressure includes the step of leaving the soft mold on the hydrophilic resin for a predetermined amount of time, wherein the weight of the soft mold applies the pressure on the hydrophilic resin.

5. The fabricating method according to claim 2, wherein the soft mold includes a rubber material having a high elasticity.

6. The fabricating method according to claim 5, wherein the rubber material includes one of polydimethylsiloxane PDMS, polyurethane, and cross-linked novolac resin

7. The fabricating method according to claim 1, wherein the step of patterning the hydrophilic resin includes the steps of:

placing a hard mold on the hydrophilic resin, the hard mold having projections aligned with areas where the thin film pattern is to be formed;

applying pressure on areas of the hydrophilic resin under the projections of the hard mold to make the projections of the hard mold to come in contact with a layer underlying the hydrophilic resin; and

removing the hard mold.

8. The fabricating method according to claim 7, wherein the layer underlying the hydrophilic resin is the substrate.

9. The fabricating method according to claim 7, wherein the step of applying pressure includes the step of applying high temperature heat.

10. The fabricating method according to claim 7, wherein the hard mold includes one of silicon and quarz.

11. The fabricating method according to claim 1, wherein the step of removing the hydrophilic resin patterns includes the step of applying H₂O over the substrate, the hydrophilic resin patterns, and the hydrophobic nano powder thin film patterns.

12. The fabricating method according to claim 1, wherein the hydrophobic nano powder thin film material is prepared by dissolving a thin film material in a hydrophobic solvent into a nano sized powder.

13. The fabricating method according to claim 12, wherein the thin film material includes at least one of Al, Cu, Cr, Mo, and Nd.

14. The fabricating method according to claim 12, wherein the hydrophobic solvent includes hexane and toluene.

15. The fabricating method according to claim 1, wherein the hydrophilic resin includes a polymer resin.

16. The fabricating method according to claim 1, wherein the step of treating includes firing the hydrophobic nano powder thin film patterns to form the thin film pattern.