Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package

• US 20060286716A1
• Filed: 12/18/2002
• Published: 12/21/2006
• Est. Priority Date: 12/18/2002
• Status: Abandoned Application

• Current Assignee: KOA Corporation
• Original Assignee: K-Tech Services Limited
• Inventors: Takayama, Toshiharu
• Application Number:
  US10/538,584
• Publication Number:
  US 20060286716A1
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: H01C 1/16 Resistor networks not otherwise provided for
• CPC Class Codes: H01C 17/003 using lithography, e.g. photolithography lithographic compositions and processing in general G03F
• CPC Class Codes: H01C 17/28 adapted for applying terminals
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H05K 2203/0542 : Continuous temporary metal layer over metal pattern reinforcing the conductive pattern characterised by the electroplating method H05K3/241
• CPC Class Codes: H05K 3/06 : the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/243 : characterised by selective plating, e.g. for finish plating of pads selective plating for making the circuit pattern H05K3/108, H05K3/182

Abstract

A method for producing a flip-chip mounting electronic component having plural terminals (3) dotted on a mounting face (1) and conductors formed on the terminals (3) realizes flip-chip mounting capable of shortening the distance between bumps (7). To realize this, a step of coating the mounting face (1) with a conductor having a predetermined thickness, a step of masking corresponding positions for the terminal (3) parts on the conductor surface, and a step of removing the conductor except the mask (6) parts are included and performed in this order. The bump is preferably constituted of copper.

Claims

1. A flip-chip mounting electronic component, comprising:

a plurality of terminals dotted on a mounting face; and

a plurality of conductors formed on said terminals,

said conductors being formed as remaining parts from growing formation and/or removal, all the sums of heights of said terminals and said conductors thereon being substantially equal, and tips of said conductors having a substantially flat face.

2. The flip-chip mounting electronic component according to claim 1,

wherein each of said conductors has a truncated cone or a truncated pyramid shape with a small tip.

3. An electronic component, comprising:

a circuit element and a plurality of terminals formed on a ceramic plate face; and

conductors formed on said terminals,

said conductors being formed as remaining parts from growing formation and/or removal, all the sums of heights of said terminals and said conductors thereon being substantially equal, and tips of said conductors having a substantially flat face.

4. The electronic component according to claim 3,

wherein each of said conductors has a truncated cone or a truncated pyramid shape with a small tip.

5. The electronic component according to claim 3,

wherein said circuit element is a multiple or a network resistor or capacitor, or a network element composed of two or more elements selected from a capacitor, a resistor element and an inductor element.

6. A method for producing a flip-chip mounting electronic component having a plurality of terminals dotted on a mounting face and a plurality of conductors formed on the terminals, comprising the steps of:

coating the mounting face with a conductor having a predetermined thickness;

masking corresponding positions for the terminal parts on the conductor surface; and

removing the conductor except the mask parts, the coating, masking and removing steps being carried out in the stated order.

7. A circuit board, comprising:

a plurality of flip-chip mounting lands dotted on a mounting face; and

a plurality of conductors formed on said terminals,

said conductors being formed as remaining parts from growing formation and/or removal, all the sums of heights of said lands and heights of said conductors thereon being substantially equal, and tips of said conductors have having a substantially flat face.

8. The circuit board according to claim 7,

wherein each of said conductors has a truncated cone or a truncated pyramid shape with a small tip.

9. A method for producing a circuit board having a plurality of flip-chip mounting lands dotted on a mounting face, comprising the steps of:

coating the mounting face with a conductor having a predetermined thickness;

masking corresponding positions for the lands on the conductor surface; and

removing the conductor except the mask parts, the coating, masking and removing steps being carried out in the stated order.

10. A method for producing a package in which mounting face terminal parts of a flip-chip mounting electronic component and/or flip-chip mounting lands of a circuit board mounting face have conductors, the method comprising:

forming the conductors as remaining parts from growing formation and/or removal; and

securing the conductors of the circuit board and the electronic component or the conductors of the electronic component and the circuit board with solder or anisotropic conductive material.

11. The method for producing a package according to claim 10,

wherein the conductors are constituted of copper and on surfaces thereof a nickel layer and a gold layer are formed in the stated order, and the securing step is carried out by fixing force of solder.