MANUFACTURING METHOD FOR A WIRELESS COMMUNICATION DEVICE AND MANUFACTURING APPARATUS
First Claim
1. A method of preparing wireless communication chips for later processing, comprising:
- positioning a wireless communication chip in a container in carrier tape;
stripping a protective adhesive from the carrier tape;
passing the carrier tape over a roller; and
forcing the wireless communication chip into contact with an adhesive tape for later processing.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
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Citations
15 Claims
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1. A method of preparing wireless communication chips for later processing, comprising:
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positioning a wireless communication chip in a container in carrier tape;
stripping a protective adhesive from the carrier tape;
passing the carrier tape over a roller; and
forcing the wireless communication chip into contact with an adhesive tape for later processing. - View Dependent Claims (2, 3)
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4. A method of preparing an antenna for use on a wireless communication device, comprising:
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passing a conductive material on an adhesive backing through a pair of rollers, one of said pair being a die cut roller;
die-cutting the conductive material with the die cut roller into a pair of antenna tabs;
removing unused conductive material from the adhesive backing; and
passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate. - View Dependent Claims (5, 6, 7)
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8. A method of preparing an antenna for use on a wireless communication device, comprising:
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passing a metal foil through a pair of rollers, one of said pair being a die cut roller;
die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and
passing the antenna tabs downstream for securement to a substrate.
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9. A method of preparing an antenna for use with a wireless communication device, comprising:
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passing a conductive material on an adhesive backing through a pair of rollers, each of said rollers being a die cut roller;
adjusting the position of the die cut rollers relative to each other to adjust the size of antenna tabs cut by the rollers;
die-cutting the conductive material with the pair of die cut rollers into a pair of antenna tabs;
removing unused conductive material from the adhesive backing; and
passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate. - View Dependent Claims (10, 11, 12)
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13. A method of preparing an antenna for use with a wireless communication device, comprising:
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passing a conductive material through a pair of rollers, each of said rollers being a die cut roller;
adjusting the position of the die cut rollers relative to each other to adjust the size of antenna tabs cut by the rollers;
die-cutting the conductive material with the die cut rollers into a pair of antenna tabs; and
passing the antenna tabs downstream for further processing. - View Dependent Claims (14, 15)
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Specification