MANUFACTURING METHOD FOR A WIRELESS COMMUNICATION DEVICE AND MANUFACTURING APPARATUS

• US 20060288563A1
• Filed: 08/30/2006
• Published: 12/28/2006
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Granted Patent: US 7,650,683 B2
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. A method of preparing wireless communication chips for later processing, comprising:

positioning a wireless communication chip in a container in carrier tape;

stripping a protective adhesive from the carrier tape;

passing the carrier tape over a roller; and

forcing the wireless communication chip into contact with an adhesive tape for later processing.

2. The method of claim 1 wherein said later processing comprises joining said wireless communication chip to an antenna element to form a wireless communication device.

3. The method of claim 2 wherein joining said wireless communication chip to an antenna element to form a wireless communication device comprises passing a substrate having the antenna element and the adhesive tape between two heated rollers to secure the wireless communication chip to the antenna element.

4. A method of preparing an antenna for use on a wireless communication device, comprising:

passing a conductive material on an adhesive backing through a pair of rollers, one of said pair being a die cut roller;

die-cutting the conductive material with the die cut roller into a pair of antenna tabs;

removing unused conductive material from the adhesive backing; and

passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate.

5. The method of claim 4 wherein said conductive material is a copper foil.

6. The method of claim 4 wherein said conductive material is an aluminum foil.

7. The method of claim 4 further comprising positioning said die cut roller such that said die cut roller is spaced from the adhesive backing by said metal foil.

8. A method of preparing an antenna for use on a wireless communication device, comprising:

passing a metal foil through a pair of rollers, one of said pair being a die cut roller;

die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and

passing the antenna tabs downstream for securement to a substrate.

9. A method of preparing an antenna for use with a wireless communication device, comprising:

passing a conductive material on an adhesive backing through a pair of rollers, each of said rollers being a die cut roller;

adjusting the position of the die cut rollers relative to each other to adjust the size of antenna tabs cut by the rollers;

die-cutting the conductive material with the pair of die cut rollers into a pair of antenna tabs;

removing unused conductive material from the adhesive backing; and

passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate.

10. The method of claim 9, wherein said conductive material is a copper foil.

11. The method of claim 9, wherein said conductive material is an aluminum foil.

12. The method of claim 9, further comprising positioning said pair of die cut rollers such that said die cut rollers are spaced from the adhesive backing by said conductive material.

13. A method of preparing an antenna for use with a wireless communication device, comprising:

passing a conductive material through a pair of rollers, each of said rollers being a die cut roller;

adjusting the position of the die cut rollers relative to each other to adjust the size of antenna tabs cut by the rollers;

die-cutting the conductive material with the die cut rollers into a pair of antenna tabs; and

passing the antenna tabs downstream for further processing.

14. The method of claim 13, wherein said conductive material is a copper foil.

15. The method of claim 13, wherein said conductive material is an aluminum foil.