Molded stiffener for thin substrates

• US 20060290011A1
• Filed: 08/31/2006
• Published: 12/28/2006
• Est. Priority Date: 02/15/2002
• Status: Abandoned Application

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Cobbley, Chad A., Baerlocher, Cary J.
• Application Number:
  US11/513,791
• Publication Number:
  US 20060290011A1
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49558 Insulating layers on lead frames, e.g. bridging members
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

Claims

1. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold configured to form a mass on a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element.

2. The system of claim 1, wherein the mold is configured to form a cross member on the die.

3. The system of claim 2, wherein the cross member is selected from the group consisting of a grid, a lattice, a grille, and a web.

4. The system of claim 1, wherein the mold is configured to form an enclosure on the die for receiving and containing a flowable material therein.

5. The system of claim 1, wherein the apparatus is configured to process the die situated on a substrate in reel form.

6. The system of claim 1, wherein the apparatus is configured with an automated transfer mechanism to move the die on a substrate utilizing index holes on the substrate.

7. The system of claim 1, wherein the apparatus is configured to process the die situated on a leadframe.

8. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold configured to form a mass on a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element, and protruding from a surface of the die.

9. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold configured to form a mass within a recess in a surface of a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element, and situated within said recess.

10. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate;

a mold configured to form a mass on a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element; and

at least one of a heating element, cooling element, and a radiation source being configured to effect hardening of the mass on the die.

11. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold configured to pattern a mass on a semiconductor die at about the periphery of the die during a molding process to produce a stiffener at said periphery of the die.

12. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold configured to form a mass on opposing surfaces of a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured each of said surfaces of the die without attachment with an adhesive element.

13. A system for fabricating a semiconductor device, comprising:

an apparatus configured for dispensing a molding compound onto a substrate; and

a mold having a mold gate and configured to form a mass on a semiconductor die at about the periphery of the die during a molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element.

14. A system for fabricating a semiconductor device, comprising:

a transfer molding apparatus configured for dispensing a molding compound; and

a mold configured to receive the molding compound therein and form a mass on a semiconductor die at about the periphery of the die during a transfer molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element.

15. A system for fabricating a semiconductor device, comprising:

an injection molding apparatus configured for dispensing a molding compound; and

a mold having a mold gate and configured to receive the molding compound therein and form a mass on a semiconductor die at about the periphery of the die during an injection molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element.

16. A system for fabricating a semiconductor device, comprising:

a spray molding apparatus configured with a spraying element for dispensing a molding compound; and

a mold comprising a template configured to pattern a mass on a semiconductor die at about the periphery of the die during a spray molding process to produce a stiffener molded onto and secured to the die without attachment with an adhesive element.

17. The system of claim 16, wherein the template is selected from the group consisting of a mask, a stencil, and a screen.