Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

• US 20060290457A1
• Filed: 04/10/2006
• Published: 12/28/2006
• Est. Priority Date: 06/27/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Moon-chul, Kim, Woon-bae, Hwang, Jun-sik, Lee, Eun-sung, Shin, Jea-shik, Kwon, Jong-oh
• Granted Patent: US 7,408,434 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/4906 Providing winding
• CPC Class Codes: Y10T 29/49064 by coating
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Claims

1. An inductor, comprising:

a substrate; and

a coil electrode embedded in the substrate, the coil electrode comprising a metal.

2. The inductor as claimed in claim 1, wherein the coil electrode is formed in a linear spiral shape.

3. The inductor as claimed in claim 1, wherein the coil electrode is formed in a curved spiral shape.

4. The inductor as claimed in claim 1, wherein the substrate is an Si substrate.

5. The inductor as claimed in claim 1, wherein the coil electrode comprises gold, silver, copper, or a combination thereof.

6. An inductor, comprising:

a substrate;

a coil electrode embedded in the substrate, the coil electrode comprising a metal;

an insulation layer formed on the substrate; and

an external connection pad formed on the insulation layer to be connected to the coil electrode.

7. The inductor as claimed in claim 6, wherein the coil electrode is formed in a linear spiral shape.

8. The inductor as claimed in claim 6, wherein the coil electrode is formed in a curved spiral shape.

9. The inductor as claimed in claim 6, wherein the substrate is an Si substrate.

10. The inductor as claimed in claim 6, wherein the coil electrode comprises gold, silver, copper, or a combination thereof.

11. The inductor as claimed in claim 10, wherein the external connection pad is made of the same metal as the coil electrode.

12. The inductor as claimed in claim 8, wherein the insulation layer is made of a low dielectric material.

13. A manufacturing method of an inductor, comprising:

forming a seed layer for plating on a bottom surface of a substrate;

forming an etch mask pattern on a top surface of the substrate;

forming a hole on the substrate according to the etch mask pattern;

forming a coil electrode by filling a metal in the hole by a plating process using the seed layer;

forming an insulation layer pattern on the top surface of the substrate; and

forming an external connection pad on the insulation layer.

14. A micro device package, comprising:

a package body on which a micro device and an electrode pad are formed; and

a cap coupled to the package body, for sealing up the micro device,

wherein the cap comprises;

a substrate having a cavity on its bottom surface;

an inverter having a coil electrode formed by filling a metal in a hole formed on the substrate;

a device connection pad formed on the bottom surface of the substrate to contact the electrode pad of the package body; and

a second external connection pad connected to the device connection pad and exposed through a top surface of the substrate.

15. The micro device package as claimed in claim 14, wherein the coil electrode is formed in a linear spiral shape.

16. The micro device package as claimed in claim 14, wherein the coil electrode is formed in a curved spiral shape.

17. The micro device package as claimed in claim 14, wherein the substrate is a Si substrate.

18. The micro device package as claimed in claim 14, wherein the coil electrode comprises gold, silver, copper, or a combination thereof.

19. The micro device package as claimed in claim 18, wherein the second external connection pad is made of the same metal as the coil electrode.

20. The micro device package as claimed in claim 14, wherein the micro device is a MEMS device.

21. The micro device package as claimed in claim 20, wherein the MEMS device is an RF duplexer or a micro switch.

22. A manufacturing method of a cap for a micro device package, comprising:

forming a cavity on a bottom surface of a substrate;

forming a seed layer for plating on the bottom surface of the substrate including the cavity;

forming an etch mask pattern on a top surface of the substrate;

forming a hole on the substrate according to the etch mask pattern;

forming a coil electrode by filling a metal in the hole by a plating process using the seed layer;

forming an insulation layer pattern on the top surface of the substrate;

forming an external connection pad on the insulation layer; and

forming an electrode pad and a sealing pad by patterning the seed layer on the bottom surface of the substrate.