Printed circuit board having embedded RF module power stage circuit

• US 20060291177A1
• Filed: 06/07/2006
• Published: 12/28/2006
• Est. Priority Date: 06/22/2005
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yoon, Hee Soo, Park, Sang Soo, Lee, Dong Hwan, Ju, Jae Cheol, Choi, Don Chul
• Granted Patent: US 7,663,892 B2
• Time in Patent Office: Days
• US Class Current: 361/780
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0104 Zirconium [Zr]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01073 Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/04941 TiN
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 1/023 : using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 1/0233 : Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 2201/09309 : Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09454 : Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• CPC Class Codes: H05K 2201/09718 : Clearance holes
• CPC Class Codes: H05K 2201/10022 : Non-printed resistor
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 3/4611 : by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Claims

1. A printed circuit board having an RF module power stage embedded therein, comprising:

a power supply plane, which is formed in a multilayered printed circuit board, includes a connection pad electrically insulated therefrom, and is connected to an outer power supply line;

a first device, one terminal of which is placed on the connection pad of the power supply plane, and the other terminal of which is placed on the power supply plane; and

a second device, which is formed in the multilayered printed circuit board, is connected to the first device through a first connection via hole, and is connected to an RF IC module mounted in the multilayered printed circuit board through a second connection via hole.

3. The printed circuit board as set forth in claim 1, wherein the first device is a resistor.

4. The printed circuit board as set forth in claim 1, wherein the first device is an inductor.

5. The printed circuit board as set forth in claim 1, wherein the second device comprises:

a first electrode formed in the multilayered printed circuit board;

a dielectric layer laminated on the first electrode; and

a second electrode formed on the dielectric layer.

2. A printed circuit board having an RF module power stage embedded therein, comprising:

a power supply plane, which is formed in a multilayered printed circuit board, is connected to an outer power supply line, and has a connection pad region defined therein;

a first device, one terminal of which is placed on the connection pad region of the power supply plane, which is provided perpendicular to the power supply plane; and

a second device, which is formed in the multilayered printed circuit board, is connected to the other terminal of the first device, and is connected to an RF IC module mounted in the multilayered printed circuit board through a connection via hole.

6. A printed circuit board having an RF module power stage embedded therein, comprising:

a power supply plane, which is formed in a multilayered printed circuit board, includes a connection pad electrically insulated therefrom, and is connected to an outer power supply line;

a first device, one terminal of which is placed on the connection pad of the power supply plane, and the other terminal of which is placed on the power supply plane;

a second device, which is formed in the multilayered printed circuit board, is connected to the first device through a first connection via hole, and is connected to an RF IC module mounted in the multilayered printed circuit board through a second connection via hole; and

a third device, which is formed in the multilayered printed circuit board, is connected to the second device through a third connection via hole, and is connected to the RF IC module mounted in the multilayered printed circuit board through a fourth connection via hole.

7. A printed circuit board having an RF module power stage embedded therein, comprising:

a power supply plane, which is formed in a multilayered printed circuit board, is connected to an outer power supply line, and has a connection pad region defined therein;

a first device, one terminal of which is placed on the connection pad of the power supply plane, which is provided perpendicular to the power supply plane;

a second device, which is formed in the multilayered printed circuit board, is connected to the other terminal of the first device, and is connected to an RF IC module mounted in the multilayered printed circuit board through a first connection via hole; and

a third device, which is formed in the multilayered printed circuit board, is connected to the second device through a second connection via hole, and is connected to the RF IC module mounted in the multilayered printed circuit board through a third connection via hole.