Package having bond-sealed underbump
First Claim
Patent Images
1. A microelectromechanical device package, comprising:
- a first substrate wafer;
a second substrate wafer, the second substrate wafer composed of an optical quality material; and
an underbump interposed between the first substrate wafer and the second substrate wafer, the underbump composed of a standoff region and a localized bond region, wherein the first and second substrate wafers and underbump define a chamber; and
at least one microelectronic device operatively disposed within the chamber.
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Abstract
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
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Citations
63 Claims
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1. A microelectromechanical device package, comprising:
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a first substrate wafer;
a second substrate wafer, the second substrate wafer composed of an optical quality material; and
an underbump interposed between the first substrate wafer and the second substrate wafer, the underbump composed of a standoff region and a localized bond region, wherein the first and second substrate wafers and underbump define a chamber; and
at least one microelectronic device operatively disposed within the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13-36. -36. (canceled)
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37. An integrated circuit, comprising:
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a semiconductor substrate;
an optical quality glass substrate positioned a spaced distance from the semiconductor substrate;
an underbump interposed between the semiconductor substrate and the optical quality glass substrate, the underbump composed of a standoff region and a localized high-temperature bond region, wherein the semiconductor substrate, the optical quality glass substrate and the underbump define a chamber; and
at least one microelectromechanical device operatively disposed within the chamber. - View Dependent Claims (40, 41, 43, 45)
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38-39. -39. (canceled)
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42. (canceled)
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44. (canceled)
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46-60. -60. (canceled)
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61. A microelectromechanical device package, comprising:
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a first substrate;
a second substrate;
means for connecting the first substrate to the second substrate, the connecting means interposed between the first and second substrates such that the first and second substrates are positioned a spaced distance from one another and define at least one chamber therebetween;
means, defined within the connecting means, for filling the chamber with at least one of a functional fluid or gas after the first and second substrates are connected; and
means for performing at least one microelectromechanical function, the microelectromechanical function performing means operatively disposed in the chamber. - View Dependent Claims (62, 63)
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Specification