Material management in substrate processing

• US 20060292846A1
• Filed: 05/05/2006
• Published: 12/28/2006
• Est. Priority Date: 09/17/2004
• Status: Abandoned Application

• Current Assignee: Intermolecular Incorporated
• Original Assignee: Intermolecular Incorporated
• Inventors: Pinto, Gustavo A., Chiang, Tony P.
• Application Number:
  US11/418,800
• Publication Number:
  US 20060292846A1
• Time in Patent Office: Days
• US Class Current: 438/597
• CPC Class Codes: H01L 21/32051 Deposition of metallic or metal-silicide layers
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 21/76834 formation of thin insulating films on the sidewalls or on top of conductors H01L21/76831 takes precedence
• CPC Class Codes: H01L 21/76841 Barrier, adhesion or liner layers
• CPC Class Codes: H01L 21/76849 the layer being positioned on top of the main fill metal
• CPC Class Codes: H01L 21/76871 Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers

Abstract

Substrate processing systems and methods are described for processing substrates. The processing includes transferring electronic identification (ID) information of one or more materials contained in one or more processing subsystems. Materials are transferred between one or more material containers and respective one or more process cells during transfer events of the processing. Information or data of the transferred materials is automatically captured during the transfer events. Processing systems described include at least one identification (ID) device coupled to the subsystems. A data device is coupled to the ID device and to a device that performs the material transfers. The data device is configured to send or receive identification information of the subsystems from the ID device, and to send or receive information of transferred material from the material handling device.

Claims

1. A system comprising:

at least one identification (ID) device coupled to one or more subsystems;

at least one material handling device coupled to transfer material between the subsystems; and

a data device coupled to the at least one ID device and the at least one material handling device, the data device configured to send or receive identification information of the subsystems from the ID device, and to send or receive information of transferred material from the material handling device.

2. The system of claim 1, wherein the subsystems include material containers, material delivery systems, material synthesis systems, tools, process tools, process modules, process cells, metrology tools, and inspection tools.

3. The system of claim 2, wherein the material containers include materials for use in one or more processes.

4. The system of claim 3, wherein the processes include one or more of wet semiconductor processes and dry semiconductor processes.

5. The system of claim 3, wherein the materials include one or more of process chemicals, gases, liquids, solids, and substrates.

6. The system of claim 5, wherein the substrates include one or more of blanket wafers, patterned wafers, substrates including devices, substrates including functional chips, substrates including functional devices, and substrates including test structures.

7. The system of claim 1, wherein the information of transferred material includes one or more of information of a start date of each transfer event, a start time of each transfer event, a stop date of each transfer event, a stop time of each transfer event, an amount of material transferred, a flow rate of each transfer event, a temperature of each transfer event, a pressure of each transfer event, process tool settings during each transfer event, process module settings during each transfer event, process cell settings during each transfer event, process parameters during each transfer event, and the sequence of each material transfer event.

8. The system of claim 1, wherein the identification information of the subsystems includes electronic identification information that corresponds to one or more of a material container, a material contained in the material container, a name of the material manufacturer, a name of the licensed user of the material, a material production lot number, date of material production, place of production, date of material fill of a material container, place of material fill of a material container, date of first use, time of first use, date of last refill, time of last refill, and place of last refill.

9. The system of claim 1, wherein the identification information of the subsystems includes electronic identification information that corresponds to one or more of a tool and a process cell that receives material transferred from the at least one material handling device.

10. The system of claim 1, wherein the data device is configured to record the identification information and the information of transferred material.

11. The system of claim 1, wherein the data device is configured to correlate the identification information with the information of transferred material.

12. The system of claim 1, wherein the data device is configured to generate inventory information of the material in response to the identification information and the information of transferred material.

13. The system of claim 12, wherein the inventory information includes one or more of product yield information, product lot information, and material usage information.

14. The system of claim 1, wherein the data device is configured to control the transfer of material between the subsystems in response to at least one parameter that includes the identification information, the information of transferred material, at least one process recipe, at least one process sequence, at least one material application sequence, and process conditions.

15. The system of claim 1, wherein the ID device includes one or more devices including radio frequency (RF) identification devices and bar code devices.

16. The system of claim 1, wherein the material handling device includes a flow meter.

17. The system of claim 1, wherein the material handling device includes a flow control device.

18. The system of claim 17, wherein the data device is configured to control a state of a valve in response to at least one parameter that includes the identification information, the information of transferred material, at least one process recipe, at least one process sequence, at least one material application sequence, and process conditions.

19. A method comprising:

transferring identification (ID) information between one or more subsystems, wherein the ID information is electronic;

transferring material from at least one of the one or more subsystems to at least one other of the one or more subsystems;

automatically capturing information of the transferring, wherein the captured information of the transferring is electronic; and

correlating the captured information of the transferring with the ID information.

20. The method of claim 19, wherein the ID information is received from an ID device that includes one or more devices including radio frequency (RF) identification devices and bar code devices.

21. The method of claim 19, wherein the transferring is performed by a material handling device.

22. The method of claim 21, wherein the material handling device includes a flow meter.

23. The method of claim 21, wherein the material handling device includes a flow control device.

24. The method of claim 19, wherein the subsystems include one or more of material containers, material delivery systems, material synthesis systems, tools, process tools, process modules, process cells, metrology tools, and inspection tools.

25. The method of claim 24, wherein the material containers include materials for use in one or more processes.

26. The method of claim 25, wherein the processes include one or more of wet semiconductor processes and dry semiconductor processes.

27. The method of claim 25, wherein the materials include one or more of process chemicals, gases, liquids, solids, and substrates.

28. The method of claim 27, wherein the substrates include one or more of blanket wafers, patterned wafers, substrates including devices, substrates including functional chips, substrates including functional devices, and substrates including test structures.

29. The method of claim 19, wherein a data device one or more of sends and receives the ID information and the information of the transferring.

30. The method of claim 19, further comprising recording the ID information and the information of the transferring.

31. The method of claim 19, further comprising correlating the ID information and the information of the transferring.

32. The method of claim 19, further comprising generating inventory information of the material in response to the ID information and the information of transferred material.

33. The method of claim 32, wherein the inventory information includes one or more of product yield information, product lot information, and material usage information.

34. The method of claim 19, further comprising controlling the transferring of material between the subsystems in response to at least one parameter that includes the ID information, the information of the transferring, at least one process recipe, at least one process sequence, at least one material application sequence, and process conditions.

35. The method of claim 19, wherein the information of the transferring includes one or more of information of a start date of each transfer, a start time of each transfer, a stop date of each transfer, a stop time of each transfer, an amount of material transferred, a flow rate of each transfer event, a temperature of each transfer event, a pressure of each transfer event, process tool settings during each transfer event, process module settings during each transfer event, process cell settings during each transfer event, process parameters during each transfer event, and the sequence of each material transfer event.

36. The method of claim 19, wherein the ID information includes electronic identification information that corresponds to one or more of a material container, a material contained in the material container, a name of the material manufacturer, a name of the licensed user of the material, a material production lot number, date of material production, place of production, date of material fill of a material container, place of material fill of a material container, date of first use, time of first use, date of last refill, time of last refill, and place of last refill.

37. The method of claim 19, wherein the identification information of the subsystems includes electronic identification information that corresponds to one or more of a tool and a process cell that receives material transferred from the at least one material handling device.

38. The method of claim 19, further comprising detecting a transfer event corresponding to the transferring material, and controlling one or more of the transferring of ID information and the automatic capturing of information of the transferring in response to the detected transfer event.

39. The method of claim 38, wherein the transfer event is one or more of a transfer initiation and a transfer termination.

40. A method comprising:

transferring electronic identification (ID) information of one or more materials contained in one or more subsystems for use in processing operations;

transferring at least one of the materials between one or more material containers and respective one or more process cells during one or more transfer events; and

automatically capturing information of materials transferred during the transfer events.