Micron conductive fiber heater elements

• US 20070000912A1
• Filed: 06/29/2006
• Published: 01/04/2007
• Est. Priority Date: 06/29/2005
• Status: Abandoned Application

• Current Assignee: Thomas Aisenbrey
• Original Assignee: Thomas Aisenbrey
• Inventors: Aisenbrey, Thomas
• Application Number:
  US11/477,882
• Publication Number:
  US 20070000912A1
• Time in Patent Office: Days
• US Class Current: 219/528
• CPC Class Codes: H05B 3/44 heating conductor arranged within rods or tubes of insulating material
• CPC Class Codes: H05B 3/54 flexible

Abstract

A heating element device comprises a bundle of micron conductive fiber. Each micron conductive fiber has a diameter of typically not greater than 20 microns. The bundle is operative to conduct electrical current from a first end to a second end of the bundle. An electrical insulating material may surround the bundle. The bundle may be held near, or contacting, a thermal spreading structure. The fiber may be metal or metal plated onto metal core or non-metal core. The fiber may be ferromagnetic. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Claims

1. A heating element device comprising a bundle of micron conductive fiber wherein each micron conductive fiber has a diameter of not greater than 20 microns and wherein the bundle is operative to conduct electrical current from a first end to a second end of the bundle.

2. The device of claim 1 further comprising an electrical insulating layer surrounding the bundle.

3. The device of claim 2 wherein the electrical insulating layer is glass or quartz.

4. The device of claim 2 wherein the electrical insulating layer is ceramic-based or mica-based.

5. The device of claim 2 wherein the electrical insulating layer is a high temperature capable resin or paint.

6. The device of claim 1 wherein the diameter of the micron conductive fiber not greater than about 12 microns.

7. The device of claim 1 wherein the micron conductive fiber is metal.

8. The device of claim 1 wherein the micron conductive fiber is a non-metal material with metal plating.

9. The device of claim 1 wherein the micron conductive fiber is a ferromagnetic material.

10. The device of claim 1 wherein the micron conductive fiber is surface treated.

11. The device of claim 1 wherein the first and second ends of the bundle are coupled to an electrical current source by connectors.

12. The device of claim 1 wherein the bundle is held near a thermal spreading structure.

13. The device of claim 1 wherein the bundle is held inside of a thermal spreading structure.

14. The device of claim 1 wherein the micron conductive fibers are woven, weaved, or twisted together.

15. A heating element device comprising:

a bundle of micron conductive fiber wherein each micron conductive fiber has a diameter of not greater than 20 microns and wherein the bundle is operative to conduct electrical current from a first end to a second end of the bundle; and

an insulating layer surrounding the bundle.

16. The device of claim 15 wherein the electrical insulating layer is glass or quartz.

17. The device of claim 15 wherein the electrical insulating layer is ceramic-based or mica-based.

18. The device of claim 15 wherein the electrical insulating layer is a high temperature capable resin or paint.

19. The device of claim 15 wherein the diameter of the micron conductive fiber not greater than about 12 microns.

20. The device of claim 15 wherein the micron conductive fiber is metal.

21. The device of claim 15 wherein the micron conductive fiber is a non-metal material with metal plating.

22. The device of claim 15 wherein the micron conductive fiber is a ferromagnetic material.

23. A heating element device comprising:

a bundle of micron conductive fiber wherein each micron conductive fiber has a diameter of not greater than 20 microns and wherein the bundle is operative to conduct electrical current from a first end to a second end of the bundle; and

a thermal spreading structure held near the bundle.

24. The device of claim 23 further comprising an electrical insulating layer between the thermal spreading structure and the bundle.

25. The device of claim 23 wherein the thermal spreading structure is conductive loaded resin-based material comprising micron conductive materials in a base resin host.

26. The device of claim 23 wherein the diameter of the micron conductive fiber not greater than about 12 microns.

27. The device of claim 23 wherein the thermal spreading structure is a tube.

28. The device of claim 23 wherein the thermal spreading structure is a plate.

29. The device of claim 23 wherein the bundle is held in a channel in the thermal spreading structure.

30. The device of claim 23 wherein the bundle is held together by adhesive or paint.