Conductive paste for multilayer electronic components and multilayer electronic component using same

• US 20070001152A1
• Filed: 06/27/2006
• Published: 01/04/2007
• Est. Priority Date: 07/01/2005
• Status: Active Grant

• Current Assignee: Shoei Chemical Inc.
• Original Assignee: Shoei Chemical Inc.
• Inventors: Yoneima, Toshio, Higashi, Kaori
• Granted Patent: US 7,423,220 B2
• Time in Patent Office: Days
• US Class Current: 252/500
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2203/0783 Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste comprising a conductive powder, a resin and an organic solvent, wherein the organic solvent comprises at least one solvent selected from an alkylene glycol diacetate and an alkylene glycol dipropionate. A multilayer electronic component is obtained by firing at high temperature an unfired laminate prepared by alternately stacking ceramic green sheets and internal electrode paste layers in which each of the internal electrode paste layers is formed by the above conductive paste. The conductive paste has appropriate viscosity characteristics and long-term stability, which allows manufacturing highly reliable multilayer electronic components having excellent electrical characteristics, without causing sheet attack.

Claims

1. A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste comprising a conductive powder, a resin and, an organic solvent, wherein the organic solvent comprises at least one solvent selected from an alkylene glycol diacetate and an alkylene glycol dipropionate.

2. The conductive paste for multilayer electronic components according to claim 1, wherein said alkylene glycol diacetate is a diacetate of an alkylene glycol having 2 to 6 carbon atoms, and said alkylene glycol dipropionate is a dipropionate of an alkylene glycol having 2 to 6 carbon atoms.

3. The conductive paste for multilayer electronic components according to claim 1, wherein said ceramic green sheet is a ceramic green sheet having a thickness of 5 μ

m or less.

4. The conductive paste for multilayer electronic components according to claim 1, wherein said ceramic green sheet comprises a resin binder containing a butyral resin as a main component.

5. The conductive paste for multilayer electronic components according to claim 1, wherein a main component of the resin contained in the conductive paste is a cellulose resin.

6. A multilayer electronic component obtained by firing at high temperature an unfired laminate prepared by alternately stacking ceramic green sheets and internal electrode paste layers, wherein each of said internal electrode paste layers is formed using the conductive paste for multilayer electronic components according to claim 1.

7. The multilayer electronic component according to claim 6, wherein the thickness of said ceramic green sheets is 5 μ

m or less.

8. The multilayer electronic component according to claim 6, wherein each of said ceramic green sheets comprises a resin binder containing a butyral resin as a main component.