Semiconductor device for emitting light and method for fabricating the same
First Claim
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1. A semiconductor light emitting device comprising:
- a package having two or more terminals;
two or more semiconductor devices mounted in the package to emit lights, each having a predetermined wavelength; and
a molding unit mixed with a phosphor that is excited by the lights emitted from the semiconductor devices to emit light having a wavelength different from those of the lights emitted from the semiconductor devices.
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Abstract
A semiconductor light emitting device includes a package (5) having two or more terminals, two or more semiconductor devices (1,2) mounted in the package to emit lights each having a predetermined wavelength, and a molding unit (3) mixed with a phosphor. The phosphor is excited by the lights emitted from the semiconductor devices to emit light having a wavelength different from those of the lights emitted from the semiconductor devices.
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Citations
19 Claims
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1. A semiconductor light emitting device comprising:
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a package having two or more terminals;
two or more semiconductor devices mounted in the package to emit lights, each having a predetermined wavelength; and
a molding unit mixed with a phosphor that is excited by the lights emitted from the semiconductor devices to emit light having a wavelength different from those of the lights emitted from the semiconductor devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for making a semiconductor light emitting device, comprising the steps of:
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mounting two or more semiconductor devices on a package having two or more terminals;
electrically connecting the semiconductor devices to each other using a conductive wire; and
forming a molding unit by molding a mixture of a phosphor and a transparent molding material, the phosphor being excited by the lights emitted from the semiconductor devices to emit light having a wavelength different from those of the lights emitted from the semiconductor devices. - View Dependent Claims (18, 19)
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Specification