Three-dimensional semiconductor module having multi-sided ground block

• US 20070001282A1
• Filed: 03/06/2006
• Published: 01/04/2007
• Est. Priority Date: 07/01/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Baek, Seung-Duk, Kang, Sun-Won
• Granted Patent: US 7,508,061 B2
• Time in Patent Office: Days
• US Class Current: 257/692
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/065 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The unit semiconductor device has a structure in which a semiconductor package (or semiconductor chip) is mounted on a unit wiring substrate. Ground pads to be connected to the outer-facing side surfaces of the ground block are formed on the first surface of the unit wiring substrate, the semiconductor chip is mounted on the second surface opposite to the first surface, and contact terminals electrically connected to the semiconductor chip are formed on the second surface.

Claims

1. A three-dimensional semiconductor module, the module comprising:

a multisided ground block including outer-facing side surfaces; and

a semiconductor device supported by and grounded to the outer-facing side surfaces of the ground block, the semiconductor device including semiconductor units and a wiring substrate, the wiring substrate having ground pads and having contact terminals to connect externally, the ground pads being electrically connectable to the outer-facing side surfaces of the ground block and formed on a first surface of the wiring substrate, the semiconductor units being mountable on a second surface of the wiring substrate opposite to the first surface of the wiring substrate, and the contact terminals being formed on a lower side of the second surface of the wiring substrate to externally connect and to connect to the semiconductor units.

2. The module of claim 1, wherein the outer-facing side surfaces comprise at least two planar surfaces in non-parallel relation.

3. The module of claim 1, wherein the outer-facing side surfaces comprises at least three planar surfaces in non-coplanar relation.

4. The module of claim 1, wherein the ground block is a metal material having sufficient electrical and thermal conductivity to electrically ground and to carry heat energy relative to the semiconductor units.

5. The module of claim 1, wherein a ground terminal is formed on a bottom surface of the ground block.

6. The module of claim 1, wherein the module further includes a heat dissipation member installable on an upper surface of the ground block.

7. The module of claim 1, wherein the wiring substrate has a length corresponding to a circumferential length of the ground block and is bendable around the outer-facing side surfaces of the ground block, and wherein the ground pads on the first surface of the wiring substrate are connectable to the outer-facing side surfaces of the ground block.

8. The module of claim 7, wherein the wiring substrate is a tape wiring substrate.

9. The module of claim 8, further comprising connection wirings to interconnect connect adjacent ones of the semiconductor units.

10. The module of claim 7, wherein the wiring substrate includes first wiring substrate portions and second wiring substrate portions, the first wiring substrate portions being made of a first material and disposed on the outer-facing side surfaces of the ground block, the second wiring substrate portion being made of a second material more flexible than the first material and being bendable at edges between the outer-facing side surfaces of the ground block to interconnect adjacent ones of first wiring substrate portions.

11. The module of claim 10, wherein the first wiring substrate portions include at least one of a printed circuit board, ceramic board, and a silicon board.

12. The module of claim 10, wherein the second wiring substrate portions include a tape wiring substrate.

13. The module of claim 10, wherein the ground pads are formed on a first surface of the first wiring substrate portions.

14. The module of claim 13, wherein the semiconductor units are mountable on a second surface of the first wiring substrate portions.

15. A semiconductor module, the module comprising:

a ground block having at least two planar surfaces in non-coplanar relation; and

a semiconductor device mountable and electrically connectable to the ground block, the semiconductor device including at least two semiconductor units each mountable and electrically connectable to a corresponding one of the at least two surfaces of the ground block, and including contact terminals to externally connect the semiconductor units and disposed adjacent to a bottom surface of the ground block.

16. The module of claim 15, wherein at least one of the at least two the semiconductor units comprises a semiconductor chip and a unit wiring substrate with ground pads of the unit wiring substrate being connectable to at least one of the planar surfaces of the ground block, the ground pads being formed on a first surface of the unit wiring substrate, the semiconductor chip being mountable on a second surface of the unit wiring substrate opposite to the first surface thereof, the contact terminals being formed on the second surface of the unit wiring substrate and electrically connectable to the semiconductor chip.

17. The module of claim 16, wherein the unit wiring substrate of the semiconductor device comprises a single body having sufficient flexibility bend at portions corresponding to edges between adjacent ones of the outer-facing side surfaces of the ground block.

18. The module of claim 17, further comprising connection wirings to interconnect the semiconductor units are formed on the second surface of the unit wiring substrate.

19. The module of claim 15, further comprising a connection substrate bent at an edge of the two adjacent outer-facing side surfaces of the ground block to connect adjacent unit wiring substrates.

20. The module of claim 19, wherein the connection substrate comprises a tape wiring substrate.

21. The module of claim 20, wherein the unit wiring substrate comprises at least one of a printed circuit board, ceramic board, and a silicon board.

22. The module of claim 15, wherein a first one of the semiconductor units is installed on a selected one of the outer-facing side surfaces of the ground block independently of a second one of the semiconductor units.

23. The module of claim 15, wherein the ground block is a metal material having sufficient electrical and thermal conductivity to supply ground potential and conduct heat energy relative to the semiconductor units.

24. The module of claim 15, wherein a ground terminal is formed on a bottom surface of the ground block.

25. The module of claim 15, further comprising a heat dissipation member installed on an upper surface of the ground block.

26. A semiconductor module, the module comprising:

an electrically conductive ground block having at least two surfaces, the at least two surfaces being planar surfaces in non-parallel relation; and

a semiconductor device supported by the ground block and having at least two semiconductor units to connect and ground to the at least two surfaces of the ground block, the semiconductor device including a wiring substrate having ground pads to connect to the ground block and having contact terminals to connect externally.

27. The module of claim 26, wherein the ground pads are formed on a first surface of the wiring substrate, the semiconductor units are mounted on a second surface of the wiring substrate opposite the first surface of the wiring substrate, and the contact terminals are formed on a lower side of the second surface of the wiring substrate to connect externally and to connect to the semiconductor units.

28. The module of claim 26, further comprising a ground terminal formed on a bottom surface of the ground block.

29. The module of claim 26, further comprising a heat dissipation member installable on an upper surface of the ground block.

30. The module of claim 26, wherein the wiring substrate has a length corresponding to a circumferential length of the ground block and surrounds a plurality of outer-facing side surfaces of the ground block including the at least two surfaces of the ground block, and the ground pads on the first surface of the wiring substrate are connectable to the outer-facing side surfaces of the ground block.

31. The module of claim 30, wherein the wiring substrate includes first wiring substrate portions and second wiring substrate portions, the first wiring substrate portions being made of a given material and disposed on the at least two surfaces of the ground block, the second wiring substrate portions being made of a material relatively more flexible than the given material, bendable at edges between the outer-facing side surfaces of the ground block, and formed to connect adjacent ones of the first wiring substrate portions.

32. The module of claim 31, wherein the ground pads are formed on a first surface of the first wiring substrate portions.

33. The module of claim 31, wherein the semiconductor units are mounted on second surface of the first wiring substrate portions.