Method of manufacturing a contactless chip card with enhanced evenness
First Claim
1. A method of manufacturing a contactless chip card including an antenna support on which the antenna is screenprinted and an electronic module or a chip connected to the two antenna terminals and at least two card bodies on either side of said antenna support, the card bodies being thermoplastic sheets applied by hot pressure lamination wherein the sheet of thermoplastic which is applied onto the face of the antenna support receiving electronic module or chip is perforated with a through-cavity and its thickness is greater than the thickness of electronic module or chip, said through-cavity being situated such that said electronic module or chip is inside the through-cavity when said sheet is placed on said support before the lamination step and such that said electronic module or chip is not subjected to any pressure during the lamination step.
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Accused Products
Abstract
Method of manufacturing a contactless chip card including an antenna support (40) on which the antenna is screenprinted and an electronic module or a chip (50) connected to the two antenna terminals and at least two card bodies on either side of antenna support, the antenna bodies being thermoplastic sheets (62, 64, 66, and 68) applied by hot pressure lamination, the sheet of thermoplastic (62) which is applied onto the face of the antenna support (40) receiving electronic module or chip (50) is perforated with a through-cavity (56) and its thickness is greater than the thickness of electronic module or chip (50), said cavity (56) being situated such that said electronic module or chip (50) is inside the cavity when said sheet (62) is placed on said support (40) before lamination step and such that electronic module or chip (50) is not subjected to any pressure during the lamination step.
26 Citations
16 Claims
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1. A method of manufacturing a contactless chip card including an antenna support on which the antenna is screenprinted and an electronic module or a chip connected to the two antenna terminals and at least two card bodies on either side of said antenna support, the card bodies being thermoplastic sheets applied by hot pressure lamination
wherein the sheet of thermoplastic which is applied onto the face of the antenna support receiving electronic module or chip is perforated with a through-cavity and its thickness is greater than the thickness of electronic module or chip, said through-cavity being situated such that said electronic module or chip is inside the through-cavity when said sheet is placed on said support before the lamination step and such that said electronic module or chip is not subjected to any pressure during the lamination step.
Specification