Image inspection method

• US 20070002322A1
• Filed: 06/30/2005
• Published: 01/04/2007
• Est. Priority Date: 06/30/2005
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Borodovsky, Yan, Cheng, Wen-Hao
• Application Number:
  US11/173,783
• Publication Number:
  US 20070002322A1
• Time in Patent Office: Days
• US Class Current: 356/394
• CPC Class Codes: G03F 1/84 Inspecting

Abstract

Embodiments of the invention provide methods and apparatuses for detecting defects and contaminants on reticles. For one embodiment of the invention, either one or both of an aerial image database and a resist image database are created and compared to an actual scanned mask die image. For one embodiment of the invention, the comparison is used to identify defects of contaminants on the reticle. For one embodiment of the invention, a decision as to whether the reticle should be discarded or cleaned and repaired is made based upon the determined defects or contaminants.

Claims

1. A method comprising:

creating a design tape-out database pertaining to an integrated circuit design;

creating a database containing aerial image of design tapeout database under condition identical to imaging conditions mask containing design data tapeout will be used to pattern its image;

creating a data base containing collected image database based upon a collection of manufactured from said design database tapeout mask collected through the imaging system having critical to imaging identical optical characteristics such as wavelength, illumination shape and projection optics numerical aperture and pupil configuration identical to corresponding settings of exposure tool that will be employing said mask to image its content on photosensitive media on the wafer in process comparing the modeled aerial image design database to the experimentally collected image database.

2. The method of claim 1 further comprising:

determining reticle obstructions based upon the comparison.

3. The method of claim 2 wherein the obstructions are defects or contaminants.

4. The method of claim 1 wherein the design image data base is selected from the group consisting of an actinic aerial image database, a resist image database, and a combination thereof.

5. The method of claim 1 wherein the design image database is an actinic aerial image database created in consideration of specific illumination conditions corresponding to the reticle.

6. The method of claim 5 wherein the specific illumination conditions include illuminator shape, numerical aperture, and partial coherence.

7. The method of claim 1 wherein the design image database is a resist image database created in consideration of aspects of a specific photoresist.

8. The method of claim 7 wherein the aspects of the photoresist considered include positive, negative, chemically amplified, and manufacturer.

9. A system comprising:

a design data tape-out pertaining to an integrated circuit design;

a design image database based upon the design data tape out;

a scanned image database based upon a scanned mask die, the scanned mask die created from a reticle fabricated based on the design data tape-out; and

a processing system having a comparison functionality to compare the design image database to the scanned image database.

10. The system of claim 9 wherein reticle obstructions are determined by comparing the design image database to the scanned image database.

11. The system of claim 10 wherein the obstructions are defects or contaminants.

12. The system of claim 9 wherein the design image data base is selected from the group consisting of an actinic aerial image database, a resist image database, and a combination thereof.

13. The system of claim 9 wherein the design image database is an actinic aerial image database created in consideration of specific illumination conditions corresponding to the reticle.

14. The system of claim 13 wherein the specific illumination conditions include illuminator shape, numerical aperture, and partial coherence.

15. The system of claim 9 wherein the design image database is a resist image database created in consideration of aspects of a specific photoresist.

16. The system of claim 15 wherein the aspects of the photoresist considered include positive, negative, chemically amplified, and manufacturer.

17. A machine-accessible medium that provides instructions that, if executed by a processor, will cause the processor to perform a method comprising:

creating a design data tape-out pertaining to an integrated circuit design;

creating a design image database based upon the design data tape out;

creating a scanned image database based upon a scanned mask die, the scanned mask die created from a reticle fabricated based on the design data tape-out; and

comparing the design image database to the scanned image database.

18. The machine-accessible medium of claim 17 wherein the method further comprises:

determining reticle obstructions based upon the comparison.

19. The machine-accessible medium of claim 18 wherein the obstructions are defects or contaminants.

20. The machine-accessible medium of claim 17 wherein the design image data base is selected from the group consisting of an actinic aerial image database, a resist image database, and a combination thereof.

21. The machine-accessible medium of claim 17 wherein the design image database is an actinic aerial image database created in consideration of specific illumination conditions corresponding to the reticle.

22. The machine-accessible medium of claim 21 wherein the specific illumination conditions include illuminator shape, numerical aperture, and partial coherence.

23. The machine-accessible medium of claim 17 wherein the design image database is a resist image database created in consideration of aspects of a specific photoresist.

24. The machine-accessible medium of claim 23 wherein the aspects of the photoresist considered include positive, negative, chemically amplified, and manufacturer.