Cooling device and electronic apparatus

• US 20070002537A1
• Filed: 06/23/2006
• Published: 01/04/2007
• Est. Priority Date: 06/30/2005
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Granted Patent: US 7,372,697 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the heat-receiving section. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section is formed on one of the first and second plate members.

Claims

1. A cooling device comprising:

a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,

wherein the heat transfer unit comprises;

a first plate member, in which a groove corresponding to the passage is formed; and

a second plate member, which covers the groove, and

the heat-receiving section is formed on one of the first and second plate members.

2. The cooling device according to claim 1, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

3. The cooling device according to claim 1, wherein a second groove corresponding to the passage is formed in the second plate member.

4. The cooling device according to claim 1, wherein the groove comprises a plurality of grooves extending in parallel with each other.

5. The cooling device according to claim 1, wherein the groove extends across the heat-receiving section.

6. The cooling device according to claim 1, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

7. The cooling device according to claim 1, wherein a plurality of protrusions, which are inclined toward a first direction, are formed all over a sidewall of the groove.

8. The cooling device according to claim 1, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

9. The cooling device according to claim 1, wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating element, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.

10. An electronic apparatus comprising:

a casing;

a heating element housed in the casing; and

a cooling device that cools the heating element, the cooling device comprising;

a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,

wherein the heat transfer unit comprises;

a first plate member, in which a groove corresponding to the passage is formed; and

a second plate member, which covers the groove, and

the heat-receiving section is formed on one of the first and second plate members.

11. The electronic apparatus according to claim 10, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

12. The electronic apparatus according to claim 10, wherein a second groove corresponding to the passage is formed in the second plate member.

13. The electronic apparatus according to claim 10, wherein the groove comprises a plurality of grooves extending in parallel with each other.

14. The electronic apparatus according to claim 10, wherein the groove extends across the heat-receiving section.

15. The electronic apparatus according to claim 10, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

16. The electronic apparatus according to claim 10, wherein a plurality of protrusions, which are inclined toward a first direction, are formed all over a sidewall of the groove.

17. The electronic apparatus according to claim 10, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

18. The electronic apparatus according to claim 10, wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating elements, and the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.