Cooling device and electronic apparatus

• US 20070002538A1
• Filed: 06/23/2006
• Published: 01/04/2007
• Est. Priority Date: 06/30/2005
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Granted Patent: US 7,352,581 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.

Claims

1. A cooling device comprising:

a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove,

wherein the heat-receiving section is formed at least one of the first and second plate members.

2. The cooling device according to claim 1, wherein the passage is formed circularly.

3. The cooling device according to claim 1, further comprising a pump including an inlet port and a discharge port.

4. The cooling device according to claim 1, wherein a second groove corresponding to the passage is formed in the second plate member.

5. The cooling device according to claim 1, wherein the groove comprises a plurality of grooves extending in parallel with each other.

6. The cooling device according to claim 1, wherein the groove extends across the heat-receiving section.

7. The cooling device according to claim 1, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

8. The cooling device according to claim 1, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

9. The cooling device according to claim 1, wherein a third plate member is connected to at least one of the first and second plate members at a portion avoiding the first and second heating elements, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.

10. The cooling device according to claim 1, wherein the groove is turned so that first and second passages of different flow directions are provided within an area where the first and second portions of the heat-receiving section are adjacently provided along the passage.

11. An electronic apparatus comprising:

a casing;

first and second heating elements housed in the casing; and

a cooling device that cools the first and second heating elements, the cooling device comprising;

a heat transfer unit thermally connected to the mounted first heating element and the mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove,

wherein the heat-receiving section is formed at least one of the first and second plate members.

12. The electronic apparatus according to claim 11, wherein the passage is formed circularly.

13. The electronic apparatus according to claim 11, further comprising a pump including an inlet port and a discharge port.

14. The electronic apparatus according to claim 11, wherein a second groove corresponding to the passage is formed in the second plate member.

15. The electronic apparatus according to claim 11, wherein the groove comprises a plurality of grooves extending in parallel with each other.

16. The electronic apparatus according to claim 11, wherein the groove extends across the heat-receiving section.

17. The electronic apparatus according to claim 11, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

18. The electronic apparatus according to claim 11, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

19. The electronic apparatus according to claim 11, wherein a third plate member is connected to at least one of the first and second plate members at a portion avoiding the first and second heating elements, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.

20. The electronic apparatus according to claim 11, wherein the groove is turned so that first and second passages of different flow directions are provided within an area where the first and second portions of the heat-receiving section are adjacently provided along the passage.