Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
First Claim
Patent Images
1. A device package, comprising:
- a device substrate comprising a contact pad and a device;
a cap mounted on the device substrate, the cap defining a via with a slightly sloped sidewall, the cap comprising;
a contactor extending from an interior surface of the cap facing the device substrate, wherein the via is offset from the contactor;
a contactor pad located over the contactor, wherein the contactor pad contacts the contact pad;
a via pad on the interior surface of the cap under the via, wherein the via pad is coupled to the contactor pad;
a via contact over an exterior surface of the cap and in the via, wherein the via contact is coupled to the via pad.
5 Assignments
0 Petitions
Accused Products
Abstract
A device package includes a device substrate and a cap mounted on the device substrate. The device substrate includes a contact pad. The cap defines a via with a slightly sloped sidewall through the cap, a contactor extending from an interior surface of the cap, a contactor pad over the contactor, a via pad on the interior surface of the cap over the via and coupled to the contactor pad, and a via contact over the exterior surface of the cap and in the via coupled to the via pad. The contactor is offset from the via. When the cap is mounted on the device substrate, the contactor pad on the contactor is pressed and cold welded onto the contact pad on the device substrate.
-
Citations
18 Claims
-
1. A device package, comprising:
-
a device substrate comprising a contact pad and a device;
a cap mounted on the device substrate, the cap defining a via with a slightly sloped sidewall, the cap comprising;
a contactor extending from an interior surface of the cap facing the device substrate, wherein the via is offset from the contactor;
a contactor pad located over the contactor, wherein the contactor pad contacts the contact pad;
a via pad on the interior surface of the cap under the via, wherein the via pad is coupled to the contactor pad;
a via contact over an exterior surface of the cap and in the via, wherein the via contact is coupled to the via pad. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method for making a device package, comprising:
-
forming a contactor on an interior surface of a cap wafer;
forming a contactor pad over the contactor;
forming a via pad on the interior surface of the cap wafer, wherein the via pad is coupled to the contactor pad;
forming a device on a device wafer;
mounting the cap wafer on the device wafer, wherein the contactor pad on the contactor contacts a contact pad on an interior surface of the device wafer facing the cap wafer;
forming a via with a slightly sloped sidewall through the cap wafer to the via pad, wherein the via is offset from the contactor; and
forming a via contact on an exterior surface of the cap wafer and in the via, wherein the via contact is coupled to the via pad. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
Specification