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Method for containing a device and a corresponding device

  • US 20070004096A1
  • Filed: 06/26/2006
  • Published: 01/04/2007
  • Est. Priority Date: 12/24/2003
  • Status: Active Grant
First Claim
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1. A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers comprising:

  • forming one or more encapsulating layers over at least part of the micromechanical element;

    providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers; and

    providing electrical connection between the base layers, and the one or more metallization layers formed above the micromechanical element.

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