METHOD OF THINNING A WAFER
First Claim
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1. A method of thinning a wafer comprising:
- providing a wafer having a front surface and a back surface;
providing a carrier wafer;
bonding the back surface of the wafer to the carrier wafer with a bonding medium;
performing a wafer thinning process to thin the wafer from the front surface; and
removing the bonding medium to separate the wafer from the carrier wafer.
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Abstract
A method of thinning a wafer. A wafer having a front surface and a back surface is provided. Subsequently, a carrier wafer is provided, and the back surface of the wafer is bonded to the carrier wafer with a bonding medium. Following that, a wafer thinning process is performed to thin the wafer from the front surface. Finally, the bonding medium is removed so as to separate the wafer from the carrier wafer.
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Citations
18 Claims
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1. A method of thinning a wafer comprising:
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providing a wafer having a front surface and a back surface;
providing a carrier wafer;
bonding the back surface of the wafer to the carrier wafer with a bonding medium;
performing a wafer thinning process to thin the wafer from the front surface; and
removing the bonding medium to separate the wafer from the carrier wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of thinning a wafer comprising:
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providing a wafer having a front surface and a back surface;
performing a primary wafer thinning process;
providing a carrier wafer;
bonding the back surface of the wafer to the carrier wafer with a bonding medium;
performing a wafer thinning process to thin the wafer from the front surface; and
removing the bonding medium to separate the wafer from the carrier wafer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification