RFID tag and manufacturing method thereof

• US 20070007344A1
• Filed: 07/03/2006
• Published: 01/11/2007
• Est. Priority Date: 07/04/2005
• Status: Abandoned Application

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kanda, Naoya, Inoue, Kosuke, Odashima, Hitoshi, Homma, Hiroshi, Ueda, Kie
• Application Number:
  US11/478,645
• Publication Number:
  US 20070007344A1
• Time in Patent Office: Days
• US Class Current: 235/435
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

In an RFID (radio frequency identification) tag comprising an antenna formed of a conductive paste containing conductive filler like silver flakes on a base member, and an RFID chip connected to the antenna, the present invention cures a pattern of the antenna formed of the conductive paste, and then connects the RFID chip to the antenna with thermoplastic resin contained in the conductive paste by heating bump electrodes of the RFID chip in contact with the antenna. According to the present invention, Since the bump electrodes of the RFID chip and the antenna are connected to each other and establish sufficient electrical conduction therebetween without providing an anisotropic conductive sheet or the like therebetween, a highly reliable RFID tag is supplied at a low cost.

Claims

1. An RFID tag comprising an RFID IC chip and an antenna,

wherein the RFID IC chip comprising bump electrodes,

the antenna is formed of a conductive paste comprising conductive particles on one of a resin material and a paper material, the bump electrodes of the RFID IC chip are connected to the antenna by a thermoplastic resin contained in the conductive paste of the antenna, and a lower surface of the RFID IC chip and an upper surface of the antenna are covered with the thermoplastic resin.

2. The RFID tag of claim 1, wherein the conductive paste is a silver paste containing silver flakes and a thermoplastic polyester resin as a binder material.

3. The RFID tag of claim 1, wherein the conductive paste is a silver paste containing silver flakes and a thermoplastic polyolefin resin as a binder material.

4. The RFID tag of claim 1, wherein a surface of the RFID tag is laminated.

5. The RFID tag of claim 1, wherein a surface and a back surface of the RFID tag are laminated with a sheet material having a portion locally thick, and the portion of the sheet material is arranged with the RFID IC chip.

6. The RFID tag of claim 1, wherein a surface and a back surface of the RFID tag are covered with a silicone rubber.

7. An RFID tag comprising:

a base member;

an antenna layer formed of a resin material containing conductive particles on a main surface of the base member; and

an IC chip having a surface on which electrodes are formed and which faces a portion of the main surface of the base member to connect the electrodes to the antenna,

wherein the antenna has a first portion facing the surface of the IC chip and a second portion extending outside a region of the main surface of the base member covered with the IC chip,

the electrodes of the IC chip are bonded to the first portion of the antenna by the resin material of the antenna, and

a density of a solvent or a precursor of the resin material remaining the first portion of the antenna is lower than that remaining in the second portion.

8. The RFID tag of claim 7, wherein an insulating resin is formed between the portion of the main surface of the base member and the surface of the IC chip to seal a connection between the first portion of the antenna and the electrodes of the IC chip, and

the insulating resin is a thermoplastic resin having a higher glass transition temperature than that of the resin material.

9. The RFID tag of claim 8, wherein the resin material is softened from its cure state when the resin material is heated at a predetermined temperature in a range not less than 50°

C. and less than 150°

C.*

10. The RFID tag of claim 7, wherein the electrodes of the IC chip is in contact with the first portion of the antenna only via bottom surfaces thereof opposed to the main surface of the base member, and

the antenna is not in contact with any one of sides of the electrodes adjacent the bottom surfaces thereof.

11. The RFID tag of claim 10, wherein a region of the first portion of the antenna in contact with the bottom surfaces of the electrodes is thinner than the second portion of the antenna.

12. The RFID tag of claim 7, wherein the electrodes of the IC chip is in contact with the first portion of the antenna only via bottom surfaces thereof opposed to the main surface of the base member and at least portions of sides thereof adjacent to the bottom surfaces thereof, and

a region of the first portion of the antenna in contact with the bottom surfaces of the electrodes is not thinner than the second portion of the antenna.

13. A method of manufacturing an RFID tag, comprising steps of:

printing a conductive paste containing a thermoplastic resin and conductive particles on a resin material or a paper material to form an antenna;

arranging bump electrodes of an IC chip for the RFID tag in positions of the antenna in which the bump electrodes of the IC chip are to be mounted;

pressing the IC chip and the antenna by heat;

supplying a thermoplastic resin to a bonding part between the IC chip and the antenna; and

hardening the thermoplastic resin by heat.

14. A method of manufacturing an RFID tag, comprising:

bonding bump electrode surfaces of a semiconductor wafer on which a plurality of IC chips are sequentially formed to an adhesive tape;

dicing a surface of the semiconductor wafer opposite to the bump electrode surfaces to segment the semiconductor wafer into the IC chips; and

peeling the IC chips from an adhesive tape without reversing the IC chips and mounting each of the IC chips on the antenna without reversing the each of the IC chips to connect the each of the IC chips to the antenna.

15. A method of manufacturing an RFID tag, comprising:

bonding a surface of a semiconductor wafer opposite to bump electrode surfaces of the semiconductor wafer on which a plurality of IC chips are sequentially formed to a first adhesive tape;

dicing the semiconductor wafer to segment the semiconductor wafer into the IC chips;

transferring the IC chips to a second adhesive tape so that the bump electrode surfaces are adhered to the second adhesive tape;

peeling the IC chips off from the first and second adhesive tapes without reversing the IC chips; and

mounting each of the IC chips on the antenna without reversing the each of the IC chips to connect the each of the IC chips to the antenna.