Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

• US 20070007661A1
• Filed: 06/07/2006
• Published: 01/11/2007
• Est. Priority Date: 06/09/2005
• Status: Abandoned Application

• Current Assignee: F Kovac, Lester Burgess
• Original Assignee: F Kovac, Lester Burgess
• Inventors: Burgess, Lester, Kovac, F.
• Application Number:
  US11/448,955
• Publication Number:
  US 20070007661A1
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 : Fillers
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83101 : as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/838 : Bonding techniques
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A radio frequency identification device (RFID) includes a non-conductive first substrate, an integrated circuit device mounted to the carrier substrate and having at least one conductive terminal and a patterned conductive coating applied to the non-conductive substrate and in contact with the at least one conductive terminal. The patterned conductive coating includes a polymeric matrix and a conductive particulate filler, the polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the patterned conductive coating serving as an antenna. The RFID can be fabricated by affixing an IC chip to a surface of a substrate having a patterned conductive coating and applying a bridging coating to connect terminals of the IC chip to the antenna.

Claims

1. A radio frequency identification device comprising:

a) a non-conductive first substrate;

b) an integrated circuit device mounted to the first substrate and having at least one conductive terminal;

c) a patterned conductive coating applied to the first substrate and in contact with the at least one conductive terminal; and

,

d) a conductive bridging coating for electrically connecting the at least one terminal of the integrated circuit to the patterned conductive coating, the conductive bridging coating including a polymeric matrix and a conductive particulate filler, said polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the conductive bridging coating.

3. The device of claim 1 wherein the patterned conductive coating is formed into an antenna capable of receiving and conducting electromagnetic signals.

4. The device of claim 3 wherein the antenna, conductive bridging coating, and the integrated circuit device are substantially co-planar.

5. The device of claim 1 wherein the first substrate is flexible or supple.

6. The device of claim 1 wherein the first substrate is fabricated from a material selected from the group consisting of paper, polymeric film, ceramic and glass.

7. The device of claim 6 wherein the polymeric film comprises PET, mylar, and/or polyurethane.

8. The device of claim 1 wherein the patterned conductive coating comprises a metal film.

9. The device of claim 1 wherein the patterned conductive coating comprises a polymeric matrix and a conductive particulate filler, said polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the conductive bridging coating.

10. The device of claim 9 wherein the patterned conductive coating is fabricated from cured green rubber.

11. The device of claim 10 wherein the first substrate is a cured green rubber and the patterned conductive coating and the first substrate are integrally formed as a single piece.

12. The device of claim 1 further including a non-conductive second substrate with a second patterned conductive coating applied thereto, said second substrate including at least one via containing conductive coating material electrically joined to, and in physical contact with, both the second patterned coating on the second substrate and the patterned conductive coating on the non-conductive first substrate.

13. The device of claim 1 wherein the conductive particulate filler includes nanofibers of graphite, carbon, silver, gold, nickel, stainless steel, tin or copper, or metallized nanotubes, metal coated graphite, or metal coated glass.

2. The device of claim 2 wherein said polymeric matrix being capable of undergoing at least 10% deformation elastically and without significant change in the conductive properties of the conductive bridging coating.

14. A method for making a radio frequency identification device comprising the steps of:

a) providing a non-conductive carrier substrate;

b) applying to a first surface of the substrate a first patterned conductive coating;

c) affixing an integrated circuit chip to the first surface of the carrier substrate;

d) applying a fluid second conductive coating formulation to the substrate and integrated circuit chip to form a bridging electrical connection between the integrated circuit chip and the patterned first conductive coating, wherein said fluid conductive coating formulation includes a polymeric matrix material, a solvent, and a conductive particulate filler dispersed in said matrix, said polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the second conductive coating when cured or dried; and

,

e) curing or drying the second conductive coating formulation.

15. The method of claim 14 wherein the polymeric matrix is capable of undergoing at least 10% deformation elastically and without significant change in the electrical properties of the second conductive coating.

16. The method of claim 14 wherein the non-conductive carrier substrate is fabricated from paper, polymeric film, ceramic, or glass.

17. The method of claim 14 wherein the non-conductive carrier substrate is fabricated from PET, mylar, and/or polyurethane.

18. The method of claim 14 wherein the step (c) of affixing is done by adhesive bonding.

19. The method of claim 14 wherein the step (d) of applying the fluid second conductive coating is performed by a printing operation selected from casting, roller, spraying, silk screening, rotogravure printing, knife coating, curtain coating, offset printing, jetting, rotary screen, ink-jetting and lithography.

20. The method of claim 14 wherein the polymeric matrix includes a material selected from the group consisting of plasticized polyvinyl chloride, polyurethane, silicone, and natural and synthetic rubbers.

21. The method of claim 14 wherein the fluid second conductive coating formulation includes additives selected from the group consisting of plasticizers, thickeners, reducing agents, adhesion promoters, antioxidants, oxidants and defoaming agents.

22. The method of claim 14 wherein the step (e) of curing comprises drying the fluid second conductive coating formulation by removing the solvent therefrom and/or by chemically crosslinking the polymeric matrix material.

23. The method of claim 14 wherein the patterned first conductive coating is applied as a fluid first conductive coating formulation which includes a polymeric matrix material, a solvent, and a conductive particulate filler dispersed in said matrix, said polymeric matrix material being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the second conductive coating when cured.

24. The method of claim 23 wherein the nonconductive carrier substrate is fabricated from green rubber and the polymeric matrix material comprises green rubber, and step (e) further comprises thermally curing the carrier substrate and the polymeric matrix material together so as to form an integral single piece structure.

25. The method of claim 23 applying a second patterned conductive coating to a second surface of the non-conductive carrier substrate opposite the first surface, wherein perforations are made in the non-conductive carrier substrate so as to provide vias for electrical connection between said first and second patterned conductive coatings.

26. The method of claim 25 wherein the first and second patterned conductive coatings are applied by a printing operation selected from casting, roller, spraying, silk screening, rotogravure printing, knife coating, curtain coating, offset printing, jetting, rotary screen, ink-jetting and lithography.

27. The method of claim 26 further comprising affixing a non-conductive base layer to the printed non-conductive carrier substrate.

28. The method of claim 14 wherein the first patterned conductive coating comprises a metal film.

29. The method of claim 14 wherein the first patterned conductive coating is formed into an antenna capable of receiving and conducting electromagnetic signals.

30. The method of claim 29 wherein the fluid second conductive coating is applied to one or more bumped or unbumped terminals of the integrated circuit chip placed either up or down and connected to the antenna.

31. The method of claim 14 further including applying a second patterned conductive coating to an opposite second surface of the carrier substrate, said carrier substrate including at least one conductive via for electrically connecting the first and second patterned conductive coatings.

32. The method of claim 23 further comprising varying the composition, position and/or geometric configuration of the first patterned conductive coating to provide predetermined values of one or more of conductance, impedance, resistance, capacitance, inductance, resonance, permittivity, permeability and dielectric value.