Pick and place machine with improved setup and operation procedure

• US 20070010969A1
• Filed: 09/13/2006
• Published: 01/11/2007
• Est. Priority Date: 11/07/2003
• Status: Abandoned Application

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Badar, Timothy, Madsen, David, Haugen, Paul
• Application Number:
  US11/520,142
• Publication Number:
  US 20070010969A1
• Time in Patent Office: Days
• US Class Current: 702/183
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: H05K 13/0857 Product-specific machine setup; Changeover of machines or assembly lines to new product type
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part

Abstract

Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include providing first article inspection in pick and place machines by collecting images of the placement event inside the machine and identifying errors as they happen. By displaying this information as it is generated on the machine, the operator can take prompt and effective corrective actions. In one embodiment, images are taken of the placement location before and after placement of the component. These images are then processed and displayed to the operator shortly after the placement has completed. In addition to the images, key measurements are displayed to the operator to assist in the diagnosis of problems as they occur. Key features that are presented to the operator include absence/presence detection, vibration detection and manual visual inspection.

Claims

1. A pick and place machine comprising:

an image acquisition device disposed to obtain at least one image within the pick and place machine; and

a database server operably coupled to the image acquisition device, the database server configured to store the at least one image and data relative to pick and place machine operation.

2. The pick and place machine of claim 1, wherein the data relative to pick and place machine operation includes an indication of the quality of a placement operation.

3. The pick and place machine of claim 1, wherein the data relative to pick and place machine operation includes vibration present within the pick and place machine.

4. A method of acquiring images relative to pick and place machine operation, the method comprising:

acquiring an image of an operation within the pick and place machine; and

storing the image in a database.

5. The method of claim 4, wherein the operation is a placement of a component on a workpiece.

6. The method of claim 4, wherein the image is sent to the database through a common interface link.

7. The method of claim 6, wherein the common interface link includes an Ethernet communication link.

8. The method of claim 4, and further comprising querying the database.

9. The method of claim 4, wherein the database is shared and wherein the image can be retrieved using an Internet communication protocol.