Inspection system, inspection method, and method for manufacturing semiconductor device
First Claim
1. An inspection apparatus comprising:
- a plurality of inspection electrodes;
a plurality of inspection antennas;
means for controlling a position;
means for applying voltage to each of the plurality of inspection antennas; and
means for measuring potentials of the plurality of inspection electrodes;
wherein a plurality of chips and the plurality of inspection electrodes are overlapped with a certain space therebetween;
the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween; and
the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by said means for controlling a position.
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Abstract
The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process and an inspection method using the inspection system. The inspection system according to the present invention includes a plurality of inspection electrodes, a plurality of inspection antennas, a position control unit, a unit for applying voltage to each of the inspection antennas, and a unit for measuring potentials of the inspection electrodes. One feature of the inspection system is that a plurality of ID chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of ID chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of ID chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit.
11 Citations
40 Claims
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1. An inspection apparatus comprising:
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a plurality of inspection electrodes;
a plurality of inspection antennas;
means for controlling a position;
means for applying voltage to each of the plurality of inspection antennas; and
means for measuring potentials of the plurality of inspection electrodes;
wherein a plurality of chips and the plurality of inspection electrodes are overlapped with a certain space therebetween;
the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween; and
the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by said means for controlling a position. - View Dependent Claims (9, 37)
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2. An inspection apparatus comprising:
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a plurality of inspection electrodes;
a plurality of inspection antennas;
means for controlling a position;
means for applying voltage to each of the plurality of inspection antennas;
means for measuring potentials of the plurality of inspection electrodes; and
means for analyzing data having measured potentials of the plurality of inspection electrodes as information, and data having positions of the plurality of chips and the plurality of inspection electrodes as information, and obtaining data having an operating state of the chip as information;
wherein the plurality of chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by said means for controlling the position. - View Dependent Claims (10, 38)
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3. An inspection apparatus comprising:
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a plurality of inspection electrodes;
a plurality of inspection antennas;
means for controlling a position;
means for applying voltage to each of the plurality of inspection antennas; and
means for measuring potentials of the plurality of inspection electrodes;
wherein a plurality of chips formed on a substrate and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by said means for controlling the position, and wherein the substrate is interposed between the plurality of chips and the plurality of inspection antennas by said means for controlling the position. - View Dependent Claims (5, 7, 11, 39)
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4. An inspection apparatus comprising:
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a plurality of inspection electrodes;
a plurality of inspection antennas;
means for controlling a position;
means for applying voltage to each of the plurality of inspection antennas; and
means for measuring potentials of the plurality of inspection electrodes;
means for analyzing data having measured potentials of the plurality of inspection electrodes as information, and data having positions of the plurality of chips and the plurality of inspection electrodes as information, and obtaining data having an operating state of the chip as information, wherein the plurality of chips formed over a substrate and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit, and wherein the substrate is interposed between the plurality of chips and the plurality of inspection antennas by said means for controlling the position. - View Dependent Claims (6, 8, 12, 40)
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13. An inspection method comprising:
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supplying a signal or power supply voltage to each of a plurality of chips without contact using an antenna of each of the plurality of chips;
moving an inspection electrode with an arbitrary portion of the antenna or the whole antenna of each of the plurality of chips overlapped with the inspection electrode with a space therebetween; and
grasping an operating state of each of the plurality of chips from a voltage of the inspection electrode and a position of the inspection electrode. - View Dependent Claims (15, 17, 19, 21, 23)
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14. An inspection method comprising:
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overlapping each antenna of a plurality of chips with an inspection electrode with a space therebetween to supply a signal or power supply voltage to each of the plurality of chips without contact;
moving the inspection electrode with an arbitrary portion of the antenna or the whole antenna of each the plurality of chips overlapped with the inspection electrode with a space therebetween; and
grasping an operating state of each of the plurality of chips from a voltage of the inspection electrode and a position of the inspection electrode to the plurality of chips. - View Dependent Claims (16, 18, 20, 22, 24)
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25-36. -36. (canceled)
Specification