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Three-dimensional acceleration sensor and method for fabricating the same

  • US 20070017289A1
  • Filed: 07/18/2005
  • Published: 01/25/2007
  • Est. Priority Date: 07/18/2005
  • Status: Active Grant
First Claim
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1. A method for fabricating a three-dimensional acceleration sensor, comprising:

  • providing a semiconductor substrate having first and second surfaces;

    forming an insulating layer on the first surface of the semiconductor substrate;

    forming an active layer on the insulating layer;

    forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space;

    selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and

    selectively removing the active layer to form a groove separating the first region from a movable mass.

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