Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
First Claim
1. A method of fabricating a cold plate apparatus for facilitating cooling of a heat generating electronics component, the method comprising:
- forming a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;
positioning the heat transfer region of the tube within a mold and casting a heat sink member around the heat transfer region of the tube by contacting a second metal in molten form over the heat transfer region of the tube, wherein the second metal has a lower melting point than the first metal, the first metal of the tube and the molten second metal react peritectically during casting of the heat sink member to form an alloy layer between the tube and the heat sink member in the heat transfer region of the tube, and a metallurgical bond is formed between the tube and the heat sink member in the heat transfer region of the tube with cooling of the molten second metal, and wherein the first end and the second end of the tube extend from the heat sink member; and
controlling the casting of the heat sink member to minimize a thickness of the alloy layer formed between the tube and the heat sink member in the heat transfer region of the tube, wherein minimizing the thickness of the alloy layer enhances a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.
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Accused Products
Abstract
Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.
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Citations
20 Claims
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1. A method of fabricating a cold plate apparatus for facilitating cooling of a heat generating electronics component, the method comprising:
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forming a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;
positioning the heat transfer region of the tube within a mold and casting a heat sink member around the heat transfer region of the tube by contacting a second metal in molten form over the heat transfer region of the tube, wherein the second metal has a lower melting point than the first metal, the first metal of the tube and the molten second metal react peritectically during casting of the heat sink member to form an alloy layer between the tube and the heat sink member in the heat transfer region of the tube, and a metallurgical bond is formed between the tube and the heat sink member in the heat transfer region of the tube with cooling of the molten second metal, and wherein the first end and the second end of the tube extend from the heat sink member; and
controlling the casting of the heat sink member to minimize a thickness of the alloy layer formed between the tube and the heat sink member in the heat transfer region of the tube, wherein minimizing the thickness of the alloy layer enhances a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A cold plate apparatus for facilitating cooling of a heat generating electronics component, the cold plate apparatus comprising:
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a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;
a casted heat sink member comprising a second metal surrounding the heat transfer region of a tube, with the first end and the second end of the tube extending from the casted heat sink member, wherein a metallurgical bond exists between the tube and the heat sink member in the heat transfer region of the tube; and
an alloy layer between the tube and the casted heat sink member in the heat transfer region of the tube, the alloy layer having been formed during casting of the heat sink member by the first metal of the tube and the second metal of the heat sink member reacting peritectically, wherein the thickness of the alloy layer was minimized during casting of the heat sink member to enhance a heat transfer characteristic of the metallurgical bond between the tube and the heat sink member in the heat transfer region of the tube. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A fluid-cooled electronics apparatus, comprising:
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a heat generating electronics component;
a cold plate apparatus with a surface thereof coupled to a surface of the heat generating electronics component for facilitating removing heat from the heat generating electronics component, the cold plate apparatus comprising;
a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;
a casted heat sink member comprising a second metal surrounding the heat transfer region of a tube, with the first end and the second end of the tube extending from the casted heat sink member, wherein a metallurgical bond exists between the tube and the heat sink member in the heat transfer region of the tube; and
an alloy layer between the tube and the casted heat sink member in the heat transfer region of the tube, the alloy layer having been formed during casting of the heat sink member by the first metal of the tube and the second metal of the heat sink member reacting peritectically, wherein the thickness of the alloy layer was minimized during casting of the heat sink member to enhance a heat transfer characteristic of the metallurgical bond between the tube and the heat sink member in the heat transfer region of the tube. - View Dependent Claims (17, 18, 19, 20)
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Specification